AN 769: Intel FPGA Remote Temperature Sensing Diode Implementation Guide

ID 683139
Date 4/06/2022

4.1. Evaluation with Maxim Integrated* 's MAX31730 Temperature Sensing Chip Evaluation Board

This evaluation was conducted with setup steps as described in Offset Compensation .

The data was collected before and after applying the offset compensation. Different offset temperature was applied to different Intel® FPGA blocks because a single offset value cannot be applied on all blocks. The following figures show the results.

Figure 8. Data for Intel® Stratix® 10 Core Fabric

Figure 9. Data for Intel® FPGA H-Tile and L-Tile

Figure 10. Data for Intel® FPGA E-Tile

Figure 11. Data for Intel® FPGA P-Tile

Did you find the information on this page useful?

Characters remaining:

Feedback Message