Device Configuration User Guide Agilex™ 3 FPGAs and SoCs

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ID 847422
Date 5/23/2025
Public
Document Table of Contents
Document Table of Contents x
1. Device Configuration User Guide: Agilex™ 3 FPGAs and SoCs 2. Agilex™ 3 Configuration Details 3. Agilex™ 3 Configuration Schemes 4. Including the Reset Release IP in Your Design 5. Remote System Update (RSU) 6. Agilex™ 3 Configuration Features 7. Agilex™ 3 Debugging Guide 8. Document Revision History for the Device Configuration User Guide: Agilex™ 3 FPGAs and SoCs
1. Device Configuration User Guide: Agilex™ 3 FPGAs and SoCs x
1.1. Agilex™ 3 Configuration Overview 1.2. Agilex™ 3 Configuration Architecture
1.1. Agilex™ 3 Configuration Overview x
1.1.1. Configuration and Related Signals 1.1.2. Intel® Download Cables Supporting Configuration in Agilex™ 3 Devices
1.2. Agilex™ 3 Configuration Architecture x
1.2.1. Secure Device Manager
1.2.1. Secure Device Manager x
1.2.1.1. Updating the SDM Firmware 1.2.1.2. Specifying Boot Order for Agilex™ 3 SoC Devices
2. Agilex™ 3 Configuration Details x
2.1. Agilex™ 3 Configuration Timing Diagram 2.2. Configuration Flow Diagram 2.3. Device Response to Configuration and Reset Events 2.4. Additional Clock Requirements for HPS 2.5. Agilex™ 3 Configuration Pins 2.6. Configuration Clocks 2.7. Generating Compressed .sof File
2.5. Agilex™ 3 Configuration Pins x
2.5.1. SDM Pin Mapping 2.5.2. MSEL Settings 2.5.3. Device Configuration Pins for Optional Configuration Signals
2.5.3. Device Configuration Pins for Optional Configuration Signals x
2.5.3.1. Specifying Optional Configuration Pins 2.5.3.2. Enabling Dual-Purpose Pins 2.5.3.3. I/O Standards and Features for Configuration Pins 2.5.3.4. Specifying Pins for Partial Reconfiguration (PR)
2.5.3.1. Specifying Optional Configuration Pins x
2.5.3.1.1. nCONFIG 2.5.3.1.2. nSTATUS 2.5.3.1.3. CONF_DONE and INIT_DONE 2.5.3.1.4. SDM_IO Pins
2.5.3.3. I/O Standards and Features for Configuration Pins x
2.5.3.3.1. IBIS Model
2.6. Configuration Clocks x
2.6.1. Setting Configuration Clock Source 2.6.2. OSC_CLK_1 Clock Input
3. Agilex™ 3 Configuration Schemes x
3.1. Avalon-ST Configuration 3.2. AS Configuration 3.3. JTAG Configuration
3.1. Avalon-ST Configuration x
3.1.1. Avalon® -ST Configuration Scheme Hardware Components and File Types 3.1.2. Enabling Avalon-ST Device Configuration 3.1.3. The AVST_READY Signal 3.1.4. RBF Configuration File Format 3.1.5. Avalon-ST Single-Device Configuration 3.1.6. Debugging Guidelines for the Avalon® -ST Configuration Scheme 3.1.7. IP for Use with the Avalon® -ST Configuration Scheme: Parallel Flash Loader II IP (PFL II)
3.1.7. IP for Use with the Avalon® -ST Configuration Scheme: Parallel Flash Loader II IP (PFL II) x
3.1.7.1. Functional Description 3.1.7.2. Designing with the Parallel Flash Loader II IP for Avalon-ST Single Device Configuration 3.1.7.3. Generating the Parallel Flash Loader II IP 3.1.7.4. Constraining the Parallel Flash Loader II IP 3.1.7.5. Using the Parallel Flash Loader II IP 3.1.7.6. Supported Flash Memory Devices
3.1.7.1. Functional Description x
3.1.7.1.1. Generating and Programming a .pof into CFI Flash 3.1.7.1.2. Implementing Multiple Pages in the Flash .pof 3.1.7.1.3. Storing Option Bits 3.1.7.1.4. Verifying the Option Bit Start and End Addresses 3.1.7.1.5. Implementing Page Mode and Option Bits in the CFI Flash Memory Device
3.1.7.2. Designing with the Parallel Flash Loader II IP for Avalon-ST Single Device Configuration x
3.1.7.2.1. Parallel Flash Loader II IP Parameters 3.1.7.2.2. Parallel Flash Loader II IP Signals
3.1.7.3. Generating the Parallel Flash Loader II IP x
3.1.7.3.1. Controlling Avalon-ST Configuration with Parallel Flash Loader II IP 3.1.7.3.2. Mapping Parallel Flash Loader II IP and Flash Address 3.1.7.3.3. Creating a Single Parallel Flash Loader II IP for Programming and Configuration 3.1.7.3.4. Creating Separate Parallel Flash Loader II IP Functions
3.1.7.4. Constraining the Parallel Flash Loader II IP x
3.1.7.4.1. Parallel Flash Loader II IP Recommended Design Constraints to FPGA Avalon-ST Pins 3.1.7.4.2. Parallel Flash Loader II IP Recommended Design Constraints for Using QSPI Flash 3.1.7.4.3. Parallel Flash Loader II IP Recommended Design Constraints for Using CFI Flash 3.1.7.4.4. Parallel Flash Loader II IP Recommended Constraints for Other Input Pins 3.1.7.4.5. Parallel Flash Loader II IP Recommended Constraints for Other Output Pins
3.1.7.5. Using the Parallel Flash Loader II IP x
3.1.7.5.1. Converting .sof to .pof File 3.1.7.5.2. Programming CPLDs and Flash Memory Devices Sequentially 3.1.7.5.3. Programming CPLDs and Flash Memory Devices Separately 3.1.7.5.4. Defining New CFI Flash Memory Device
3.2. AS Configuration x
3.2.1. AS Configuration Scheme Hardware Components and File Types 3.2.2. AS Single-Device Configuration 3.2.3. AS Using Multiple Serial Flash Devices 3.2.4. AS Configuration Timing Parameters 3.2.5. Skew Tolerance Guidelines 3.2.6. Programming Serial Flash Devices 3.2.7. Serial Flash Memory Layout 3.2.8. AS_CLK 3.2.9. Active Serial Configuration Software Settings 3.2.10. Quartus® Prime Programming Steps 3.2.11. Debugging Guidelines for the AS Configuration Scheme
3.2.5. Skew Tolerance Guidelines x
3.2.5.1. Maximum Allowable External AS_DATA Pin Skew Delay Guidelines Example to Determine the Skew for 1 GB Quad SPI Flash Devices 3.2.5.2. Maximum Allowable External nCSO Pin Skew Delay Guidelines
3.2.6. Programming Serial Flash Devices x
3.2.6.1. Programming Serial Flash Devices using the AS Interface 3.2.6.2. Programming Serial Flash Devices Using the JTAG Interface
3.2.7. Serial Flash Memory Layout x
3.2.7.1. Understanding Quad SPI Flash Byte-Addressing
3.2.10. Quartus® Prime Programming Steps x
3.2.10.1. Generating Programming Files Using the Programming File Generator 3.2.10.2. Programming .pof files into Serial Flash Device 3.2.10.3. Programming .jic files into Serial Flash Device
3.3. JTAG Configuration x
3.3.1. JTAG Configuration Scheme Hardware Components and File Types 3.3.2. JTAG Device Configuration 3.3.3. JTAG Multi-Device Configuration 3.3.4. Debugging Guidelines for the JTAG Configuration Scheme
3.3.2. JTAG Device Configuration x
3.3.2.1. JTAG Single-Device Configuration Using Download Cable Connections 3.3.2.2. JTAG Single-Device Configuration Using a Microprocessor
3.3.3. JTAG Multi-Device Configuration x
3.3.3.1. JTAG Multi-Device Configuration Using Download Cable
4. Including the Reset Release IP in Your Design x
4.1. Understanding the Reset Release IP Requirement 4.2. Instantiating the Reset Release IP In Your Design 4.3. Gating the PLL Reset Signal 4.4. Guidance When Using Partial Reconfiguration (PR) 4.5. Detailed Description of Device Configuration
4.5. Detailed Description of Device Configuration x
4.5.1. Device Initialization 4.5.2. Embedded Memory Block Initial Conditions 4.5.3. Protecting State Machine Logic
5. Remote System Update (RSU) x
5.1. Remote System Update Functional Description 5.2. Guidelines for Performing Remote System Update Functions for Non-HPS 5.3. Commands and Responses 5.4. Quad SPI Flash Layout 5.5. Generating Remote System Update Image Files Using the Programming File Generator 5.6. Remote System Update from FPGA Core Example
5.1. Remote System Update Functional Description x
5.1.1. RSU Glossary 5.1.2. Remote System Update Using AS Configuration 5.1.3. Remote System Update Configuration Images 5.1.4. Remote System Update Configuration Sequence 5.1.5. RSU Recovery from Corrupted Images 5.1.6. Updates with the Factory Update Image
5.3. Commands and Responses x
5.3.1. Operation Commands 5.3.2. Error Code Responses 5.3.3. Error Code Recovery
5.4. Quad SPI Flash Layout x
5.4.1. High Level Flash Layout 5.4.2. Detailed Quad SPI Flash Layout
5.4.1. High Level Flash Layout x
5.4.1.1. Standard (non-RSU) Image Layout in Flash 5.4.1.2. RSU Image Layout in Flash – SDM Perspective 5.4.1.3. RSU Image Layout – Your Perspective
5.4.1.2. RSU Image Layout in Flash – SDM Perspective x
5.4.1.2.1. Firmware Version Information
5.4.2. Detailed Quad SPI Flash Layout x
5.4.2.1. RSU Image Sub-Partitions Layout 5.4.2.2. Sub-Partition Table Layout 5.4.2.3. Configuration Pointer Block Layout 5.4.2.4. Modifying the List of Application Images
5.5. Generating Remote System Update Image Files Using the Programming File Generator x
5.5.1. Generating the Initial RSU Image 5.5.2. Generating an Application Image 5.5.3. Generating a Factory Update Image 5.5.4. Command Sequence To Perform Quad SPI Operations
5.5.1. Generating the Initial RSU Image x
5.5.1.1. Generating the Initial RSU Image Using SOF Files 5.5.1.2. Generating the Initial RSU Image Using RBF Files
5.6. Remote System Update from FPGA Core Example x
5.6.1. Prerequisites 5.6.2. Creating Initial Flash Image Containing Bitstreams for Factory Image and One Application Image 5.6.3. Programming Flash Memory with the Initial Remote System Update Image 5.6.4. Reconfiguring the Device with an Application or Factory Image 5.6.5. Adding an Application Image 5.6.6. Removing an Application Image
6. Agilex™ 3 Configuration Features x
6.1. Device Security 6.2. Configuration via Protocol 6.3. Partial Reconfiguration
7. Agilex™ 3 Debugging Guide x
7.1. Configuration Debugging Checklist 7.2. Agilex™ 3 Configuration Architecture Overview 7.3. Understanding Configuration Status Using quartus_pgm command 7.4. Configuration File Format Differences 7.5. Understanding SEUs 7.6. Reading the Unique 64-Bit CHIP ID 7.7. Understanding and Troubleshooting Configuration Pin Behavior 7.8. Configuration Debugger Tool 7.9. CRAM Integrity Check Feature
1. Device Configuration User Guide: Agilex™ 3 FPGAs and SoCs
2. Agilex™ 3 Configuration Details
3. Agilex™ 3 Configuration Schemes
4. Including the Reset Release IP in Your Design
5. Remote System Update (RSU)
6. Agilex™ 3 Configuration Features
7. Agilex™ 3 Debugging Guide
8. Document Revision History for the Device Configuration User Guide: Agilex™ 3 FPGAs and SoCs

3.2.5.1. Maximum Allowable External AS_DATA Pin Skew Delay Guidelines

You must minimize the skew on the AS_DATA and AS_CLK pins.

Skew delay includes the following elements:

  • The delay due to the differences in board traces lengths on the PCB
  • The capacitance loading of the flash device

Use the following equations to determine the skew between AS_CLK and AS_DATA:

  1. Skew(AS_CLK – AS_DATA) > –AS_CLK/2 + Tdo(max) + Tsu
  2. Skew(AS_CLK – AS_DATA) < AS_CLK/2 + Tdo(min) – Tho

Hence, the allowable range for skew between AS_CLK and AS_DATA is as follows:

–AS_CLK/2 + Tdo(max) + Tsu < Skew(AS_CLK – AS_DATA) < AS_CLK/2 + Tdo(min) – Tho

  • Tsu = Data setup time required by the quad SPI flash. Refer to your quad SPI flash datasheet.
  • Tho = Data hold time required by the quad SPI flash. Refer to your quad SPI flash datasheet.
  • Tdo = AS_DATA[3:0] output delay. Refer to the AS configuration timing specifications in the Agilex™ 3 Device Data Sheet .
  • AS_CLK = AS_CLK clock period.

Example to Determine the Skew for 1 GB Quad SPI Flash Devices

Tsu = 1.75 ns

Tho = 2.0 ns

Tdo(max) = 0.6 ns

Tdo(min) = –0.6 ns

AS_CLK = 10 ns (100 MHz)

  1. Skew(AS_CLK – AS_DATA) > –AS_CLK/2 + Tdo(max) + Tsu

    Skew(AS_CLK – AS_DATA) > –10/2 + 0.6 + 1.75

    Skew(AS_CLK – AS_DATA) > –2.65 ns

  2. Skew(AS_CLK – AS_DATA) < AS_CLK/2 + Tdo(min) – Tho

    Skew(AS_CLK – AS_DATA) < 10/2 – 0.6 – 2.0

    Skew(AS_CLK – AS_DATA) < 2.4 ns

The allowable range for skew between AS_CLK and AS_DATA is –2.65 ns < Skew(AS_CLK – AS_DATA) < 2.4 ns

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