Intel® Simics® Simulator for Intel® FPGAs: Intel Agilex® 5 E-Series Virtual Platform User Guide

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ID 786901
Date 10/02/2023
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Document Table of Contents
Document Table of Contents x
1. About This Document 2. Intel Agilex® 5 E-Series Intel® Simics® Virtual Platform 3. Intel Agilex® 5 E-Series Virtual Platform Component Intel® Simics® Models 4. Running a Simulation with the Intel Agilex® 5 E-Series HPS Model 5. Supported Use Cases A. Document Revision History
1. About This Document x
1.1. Terminology 1.2. List of Acronyms
2. Intel Agilex® 5 E-Series Intel® Simics® Virtual Platform x
2.1. Intel Agilex® 5 E-Series Universal Virtual Platform Overview 2.2. Intel Agilex® 5 E-Series Universal Virtual Platform User-Configurable Parameters 2.3. Intel Agilex® 5 E-Series Virtual Platform Key Capabilities 2.4. On-Chip Memory IP FPGA Fabric Example Design
2.1. Intel Agilex® 5 E-Series Universal Virtual Platform Overview x
2.1.1. Intel Agilex® 5 HPS Component 2.1.2. HPS Subsystem Component 2.1.3. FPGA Fabric Design 2.1.4. qsys_top Component 2.1.5. FPGA Component 2.1.6. Board Component 2.1.7. System Component 2.1.8. Target Script
2.3. Intel Agilex® 5 E-Series Virtual Platform Key Capabilities x
2.3.1. Boot-To-Operating System Prompt 2.3.2. Basic Ethernet 2.3.3. CPU Power-On and Boot Core Selection 2.3.4. Reset Flow 2.3.5. General Purpose I/O (GPIO) Loopback 2.3.6. USB Disks Hot-Plug Support
3. Intel Agilex® 5 E-Series Virtual Platform Component Intel® Simics® Models x
3.1. Intel Agilex® 5 E-Series HPS Intel® Simics® Model 3.2. Virtual Platform HPS Subsystem Components 3.3. Virtual Platform qsys_top Components 3.4. Virtual Platform Board Components
3.1. Intel Agilex® 5 E-Series HPS Intel® Simics® Model x
3.1.1. Intel Agilex® 5 E-Series HPS Intel® Simics® Model Architecture 3.1.2. PSS Subsystem Components 3.1.3. MPU and APS Subsystem 3.1.4. MPFE Subsystem 3.1.5. Additional Intel Agilex® 5 E-Series HPS Components
3.2. Virtual Platform HPS Subsystem Components x
3.2.1. External Memory Interface (EMIF) 3.2.2. Security Device Manager (SDM)
3.3. Virtual Platform qsys_top Components x
3.3.1. FPGA Fabric
3.4. Virtual Platform Board Components x
3.4.1. Marvel EMAC PHY 3.4.2. SD Card device 3.4.3. ONFI NAND Memory Device 3.4.4. SPI Flash Device 3.4.5. AT24Cxx EEPROM Device 3.4.6. I3C Device 3.4.7. USB Disk Device 3.4.8. Intel® Simics® Text Console
4. Running a Simulation with the Intel Agilex® 5 E-Series HPS Model x
4.1. Prerequisites 4.2. Intel® Simics® Simulation Setup for the Intel Agilex® 5 E-Series Device 4.3. Starting the Simulation 4.4. Getting Device Information from the Intel® Simics® Model
1. About This Document
2. Intel Agilex® 5 E-Series Intel® Simics® Virtual Platform
3. Intel Agilex® 5 E-Series Virtual Platform Component Intel® Simics® Models
4. Running a Simulation with the Intel Agilex® 5 E-Series HPS Model
5. Supported Use Cases
A. Document Revision History

3.2.2. Security Device Manager (SDM)

The following table indicates the support status of the components integrated into the Secure Device Manager. The table also indicates any component limitations the object created in the Intel® Simics® model of the FPGA component:

Component Supported? Support Status | Limitations | Objects
SDM Mailbox Yes
  • Limitations:
    • SDM mailbox is implemented as a closed box with mailbox functionality (not a fully functional model) supporting a set of commands for generating a response.
    • Registers for HPS to SDM Mailbox interaction are stubbed.
  • Object: system.board.fpga.soc_inst.hps_subsys.sdm.sdm_mailbox
QSPI Controller Yes
  • Limitations:
    • Legacy mode is unimplemented.
    • Write-protect is not supported.
    • QSPI boot is observed slow for JFFS2 file format (use UBIFs for fast boot).
    • DMA transfers are not supported.
    • Execute in Place (XIP) is not implemented.
  • Object: system.board.fpga.soc_inst.hps_subsys.sdm.qspi
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