Intel® Simics® Simulator for Intel® FPGAs: Intel Agilex® 5 E-Series Virtual Platform User Guide

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ID 786901
Date 10/02/2023
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Document Table of Contents
Document Table of Contents x
1. About This Document 2. Intel Agilex® 5 E-Series Intel® Simics® Virtual Platform 3. Intel Agilex® 5 E-Series Virtual Platform Component Intel® Simics® Models 4. Running a Simulation with the Intel Agilex® 5 E-Series HPS Model 5. Supported Use Cases A. Document Revision History
1. About This Document x
1.1. Terminology 1.2. List of Acronyms
2. Intel Agilex® 5 E-Series Intel® Simics® Virtual Platform x
2.1. Intel Agilex® 5 E-Series Universal Virtual Platform Overview 2.2. Intel Agilex® 5 E-Series Universal Virtual Platform User-Configurable Parameters 2.3. Intel Agilex® 5 E-Series Virtual Platform Key Capabilities 2.4. On-Chip Memory IP FPGA Fabric Example Design
2.1. Intel Agilex® 5 E-Series Universal Virtual Platform Overview x
2.1.1. Intel Agilex® 5 HPS Component 2.1.2. HPS Subsystem Component 2.1.3. FPGA Fabric Design 2.1.4. qsys_top Component 2.1.5. FPGA Component 2.1.6. Board Component 2.1.7. System Component 2.1.8. Target Script
2.3. Intel Agilex® 5 E-Series Virtual Platform Key Capabilities x
2.3.1. Boot-To-Operating System Prompt 2.3.2. Basic Ethernet 2.3.3. CPU Power-On and Boot Core Selection 2.3.4. Reset Flow 2.3.5. General Purpose I/O (GPIO) Loopback 2.3.6. USB Disks Hot-Plug Support
3. Intel Agilex® 5 E-Series Virtual Platform Component Intel® Simics® Models x
3.1. Intel Agilex® 5 E-Series HPS Intel® Simics® Model 3.2. Virtual Platform HPS Subsystem Components 3.3. Virtual Platform qsys_top Components 3.4. Virtual Platform Board Components
3.1. Intel Agilex® 5 E-Series HPS Intel® Simics® Model x
3.1.1. Intel Agilex® 5 E-Series HPS Intel® Simics® Model Architecture 3.1.2. PSS Subsystem Components 3.1.3. MPU and APS Subsystem 3.1.4. MPFE Subsystem 3.1.5. Additional Intel Agilex® 5 E-Series HPS Components
3.2. Virtual Platform HPS Subsystem Components x
3.2.1. External Memory Interface (EMIF) 3.2.2. Security Device Manager (SDM)
3.3. Virtual Platform qsys_top Components x
3.3.1. FPGA Fabric
3.4. Virtual Platform Board Components x
3.4.1. Marvel EMAC PHY 3.4.2. SD Card device 3.4.3. ONFI NAND Memory Device 3.4.4. SPI Flash Device 3.4.5. AT24Cxx EEPROM Device 3.4.6. I3C Device 3.4.7. USB Disk Device 3.4.8. Intel® Simics® Text Console
4. Running a Simulation with the Intel Agilex® 5 E-Series HPS Model x
4.1. Prerequisites 4.2. Intel® Simics® Simulation Setup for the Intel Agilex® 5 E-Series Device 4.3. Starting the Simulation 4.4. Getting Device Information from the Intel® Simics® Model
1. About This Document
2. Intel Agilex® 5 E-Series Intel® Simics® Virtual Platform
3. Intel Agilex® 5 E-Series Virtual Platform Component Intel® Simics® Models
4. Running a Simulation with the Intel Agilex® 5 E-Series HPS Model
5. Supported Use Cases
A. Document Revision History

2.1.2. HPS Subsystem Component

The HPS subsystem component corresponds to the model of the module that integrates all components associated with the HPS in the Intel Agilex® 5 E-Series device. It includes the HPS models, SDM mailbox, and EMIF model. A brief description of the components that integrate the HPS subsystem component is provided in the following table:
Table 3.  Components That Integrate the HPS Subsystem Component
Component Description
HPS Component The HPS component block is described in Intel Agilex 5 HPS Component.
EMIF Component Models an instance of the External Memory Interfaces (EMIF) for HPS Intel FPGA IP.
SDM Component Implements a limited functionality of the Security Device Manager (SDM) allowing servicing messages sent by the HPS component. It also includes the QSPI controller that is shared between SDM and HPS.

This component is implemented as a Python script named sm_ghrd_subsys_hps_comp.py.

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