High Bandwidth Memory (HBM2E) Interface Agilex™ 7 M-Series FPGA IP User Guide
Visible to Intel only — GUID: ogq1658417918660
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Visible to Intel only — GUID: ogq1658417918660
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2.2. HBM2E DRAM Structure
The following figure shows an example stack containing four DRAM dies, each die supporting two channels. Each die contributes additional capacity and additional channels to the stack, up to a maximum of eight channels per stack. Each channel provides access to an independent set of DRAM banks. Requests from one channel may not access data attached to a different channel.