High Bandwidth Memory (HBM2E) Interface Agilex™ 7 M-Series FPGA IP User Guide
                    
                        ID
                        773264
                    
                
                
                    Date
                    11/04/2024
                
                
                    Public
                
            
                
                    
                        1. About the High Bandwidth Memory (HBM2E) Interface Agilex™ 7 FPGA IP User Guide
                    
                    
                
                    
                        2. Introduction to High Bandwidth Memory
                    
                    
                
                    
                        3. Agilex™ 7 M-Series HBM2E Architecture
                    
                    
                
                    
                        4. Creating and Parameterizing the High Bandwidth Memory (HBM2E) Interface FPGA IP
                    
                    
                
                    
                        5. High Bandwidth Memory (HBM2E) Interface FPGA IP Interface
                    
                    
                
                    
                        6. High Bandwidth Memory (HBM2E) Interface FPGA IP Performance
                    
                    
                
                    
                        7. Debugging the High Bandwidth Memory (HBM2E) Interface FPGA IP
                    
                    
                
                    
                    
                        8. Document Revision History for High Bandwidth Memory (HBM2E) Interface FPGA IP User Guide
                    
                
                    
                        A. High Bandwidth Memory (HBM2E) Interface FPGA IP Quartus® Prime Software Flow
                    
                    
                
            
        2.2. HBM2E DRAM Structure
 The HBM2E DRAM is optimized for high-bandwidth operation using a stack of multiple DRAM devices exposing several independent interfaces called channels. Each DRAM stack supports eight channels.  
  
 
  The following figure shows an example stack containing four DRAM dies, each die supporting two channels. Each die contributes additional capacity and additional channels to the stack, up to a maximum of eight channels per stack. Each channel provides access to an independent set of DRAM banks. Requests from one channel may not access data attached to a different channel.
    Figure 2. High Bandwidth Memory Stack Consisting of Four DRAM Dies