Intel® FPGA Power and Thermal Calculator User Guide

ID 683445
Date 6/26/2023
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5.3. Intel® FPGA PTC - Main Page

The Main data entry page of the Intel® FPGA Power and Thermal Calculator (PTC) allows you to enter device, package, and cooling information, and displays thermal analysis options.
Figure 29.  Intel® FPGA PTC Main Page


The required parameters depend on whether the junction temperature is manually entered or auto computed.

Table 10.  Device Selection Parameters
Parameter Description
Family Shows the device family selected at startup, either directly or through the imported file.
Device

Select your device. Larger devices consume more static power and have higher clock dynamic power. All other power components are unaffected by device selection.

The parameter and value table on the right side of the PTC main page displays specifications of the currently selected device.

Device Grade

Select the combination of Operating Temperature, Speed Grade, and Power Option used. Refer to the device datasheet for available combinations.

Package

Select the device package. Larger packages provide a larger cooling surface and more contact points to the circuit board; thus they offer lower thermal resistance. Package selection does not affect dynamic power directly.

Power characteristics

Select typical or maximum power. There is a process variation from die-to-die. This variation primarily affects static power consumption. If you choose Typical power characteristics, estimates are based on long term projections of average power consumed by typical silicon. For FPGA board power supply design and thermal design, choose Maximum for worst-case values.

Note: Typical power characteristics should not be used for regulator sizing or thermal analysis; use Maximum power characteristics for these activities.
VCC Voltage (mV) (This field appears in the Intel® Stratix® 10 PTC only.)
Note: “Power model status” parameter is now visible as one of the rows in the parameter and value table on the right side of the PTC main page.

The Thermal Analysis section displays the junction temperature (TJ) and other thermal parameters, depending on the thermal analysis mode.

Table 11.  Thermal Analysis
Column Heading Description
Calculation mode Specifies the calculation mode for the thermal solver to use. The available choices are:
  • Use a constant junction temperature.
  • Find cooling solution for maximum junction temperature limit.
  • Find available thermal margin for cooling solution.
  • Find ambient temperature for specified cooling solution.
Note:
  1. To enable selection of non-constant calculation modes, the Power characteristics field in the Device selection group box must be set to Maximum.
  2. For more detailed information on Calculation mode settings, refer to Intel® FPGA PTC - Thermal Page.
Junction temperature, TJ (°C) Specify the junction temperature for all dies in the package. This field is available when you select Use a constant junction temperature as the Calculation mode.

In this mode, the junction temperatures for all dies in the package are assumed to have the specified value. To automatically compute junction temperatures, select one of the other options in the same field.