5. Thermal Specifications
The high performance devices installed on the Intel® FPGA PAC N3000-N require server based forced air cooling to maintain proper operating temperature. This section provides air flow requirements for the Intel® FPGA PAC N3000-N . Intel® recommends that sufficient air flow be provided to the Intel® Arria® 10 GT FPGA to maintain junction temperature below 95 °C.
|Cubic Feet per Minute (CFM)||Volumetric airflow rate, in cubic feet per minute, of air passing through the PCIe faceplate of the Intel® FPGA PAC N3000-N .|
FPGA Junction Temperature
Local Ambient temperature. Temperature of forced air as it enters the Intel® FPGA PAC N3000-N .
Note: In many systems, this is higher than the room ambient due to heating effects of chassis components.
|Intel® Arria® 10 FPGA Thermal Design Power||≤ 71 W|
|Intel® FPGA PAC N3000-N Thermal Design Power||≤ 131 W|
|Recommended FPGA Maximum Operating Temperature*||95 °C|
|FPGA Tj Max / Thermal protection shutdown||100 °C|
|Max TLA (Forward Airflow)||up to 61 °C depending on cooling flow available|
|Max TLA (Reverse Airflow)||up to 61 °C depending on cooling flow available|
|Recommended Board Max Operating Temp*||95 °C|
|Board Tj Max / Thermal protection shutdown||100 °C|
|Min TLA||-5 °C1|
|Max QSFP Power (each)||3.5 W|
|Max 12 V PCIe* Slot current*||5.5 A|
|Max 12 V AUX current*||6.25 A|
|Max FPGA core current*||50 A|
* Values can be read at runtime using the fpgainfo command.