AN 943: Thermal Modeling for Intel® Stratix® 10 FPGAs with the Intel® FPGA Power and Thermal Calculator

ID 683387
Date 3/29/2021

1. List of Abbreviations

Updated for:
Intel® Quartus® Prime Design Suite 21.1
Table 1.  Definition of terms
Abbreviation Description
CFD Computational Fluid Dynamic, a numerical analysis method for solving the conjugated heat transfer problems.
CTM Compact Thermal Model, a geometric model that is used as an input to CFD tool.
DTS Digital thermal sensor.
FAE Field application engineer.
EPE Early Power Estimator, a tool that estimates the power consumption of the FPGA device.
FPGA Field Programmable Gate Array.
HBM High Bandwidth Memory.
IHS Integrated Heat Spreader - case of an Intel® Stratix® 10 FPGA.
MCM Multi-Chip Module - an integrated circuit (IC) with more than one die.
PTC Intel® FPGA Power and Thermal Calculator.
RTL Register-transfer level.
SCM Single Chip Module.
TCASE Integrated Heat Spreader or Case Temperature. The case temperature of a component is measured with an attached heat sink. This temperature is measured at the top geometric center of the package case/die.
TTP The total power dissipation of the device. This includes static power, with static power savings subtracted. The PTC reports this value in the Power Summary window.
TDP Thermal Design Power, the power dissipated in a die that is used for thermal analysis purposes.
TA Ambient Temperature, measured locally surrounding the FPGA. The ambient temperature should be measured just upstream of a passive heat sink or at the fan inlet for an active heat sink.
TCORE Core Fabric Die Temperature.
TJ Junction Temperature.
TJ-MAX Maximum Junction Temperature, a maximum allowable absolute temperature rating of the device or a targeted value.
TIM Thermal Interface Material.
TSD Temperature Sensor Diode.
VID Voltage identification code.