AN 943: Thermal Modeling for Intel® Stratix® 10 FPGAs with the Intel® FPGA Power and Thermal Calculator

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ID 683387
Date 3/29/2021
Public
Document Table of Contents
Document Table of Contents x
1. List of Abbreviations 2. Introduction 3. Intel® Stratix® 10 FPGA Package Mechanical Design 4. Intel® Stratix® 10 FPGA Thermal Design Parameters 5. Thermal Design Process for Intel® Stratix® 10 Devices 6. Power and Thermal Calculator (PTC) for Intel® Stratix® 10 Devices 7. Maximum Power and Typical Power 8. Document Revision History for AN 943: Thermal Modeling for Intel® Stratix® 10 FPGAs with the Intel® FPGA Power and Thermal Calculator
3. Intel® Stratix® 10 FPGA Package Mechanical Design x
3.1. Intel® Stratix® 10 Physical Package Structure
4. Intel® Stratix® 10 FPGA Thermal Design Parameters x
4.1. Intel® Stratix® 10 Compact Thermal Model (CTM) 4.2. Intel® Stratix® 10 Temperature Sensing 4.3. Thermal Sensor Accuracy
6. Power and Thermal Calculator (PTC) for Intel® Stratix® 10 Devices x
6.1. Device Selection 6.2. Logic Design Information 6.3. Thermal Settings and Parameters 6.4. Thermal Design Optimization 6.5. Updating Thermal Parameters 6.6. Intel® Stratix® 10 Device with PCIe Thermal Design Example 1 6.7. Heat Sink 6.8. Intel® Stratix® 10 Device with PCIe Thermal Design Example 2 (Alternate Method)
6.8. Intel® Stratix® 10 Device with PCIe Thermal Design Example 2 (Alternate Method) x
6.8.1. Analyzing 1U Sled with 3 FPGAs
1. List of Abbreviations
2. Introduction
3. Intel® Stratix® 10 FPGA Package Mechanical Design
4. Intel® Stratix® 10 FPGA Thermal Design Parameters
5. Thermal Design Process for Intel® Stratix® 10 Devices
6. Power and Thermal Calculator (PTC) for Intel® Stratix® 10 Devices
7. Maximum Power and Typical Power
8. Document Revision History for AN 943: Thermal Modeling for Intel® Stratix® 10 FPGAs with the Intel® FPGA Power and Thermal Calculator

6.8. Intel® Stratix® 10 Device with PCIe Thermal Design Example 2 (Alternate Method)

This example presents an alternative way of analyzing the thermal design, by determining the effective ΨCA of the individual FPGA in the system and its ambient temperature.

The Thermal page of the Intel® FPGA Power and Thermal Calculator (PTC) reports the required ΨCA for the FPGA. Consequently, if you can determine the ΨCA for the FPGA in question, you can then readily determine whether the system has sufficient cooling. Or by inserting the effective ΨCA and ambient temperature, you could determine the FPGA junction temperatures and other thermal parameters. This method is especially useful for large systems and deployed systems in the field where the cooling design is fixed. For this method you can measure the effective ΨCA and effective ambient temperature experimentally, or determine them by CFD analysis. In either case, the result is valid only if other components of the system—especially upstream components—are powered up as they would be in the actual system, and are not subject to change.

To perform the measurement or analysis keep all the transceiver powers constant but vary the core die powers by ±25% and determine the FPGA case temperature as a function of total thermal power (TTP). You can then use a simple linear regression to determine the ΨCASE-AMB,EFF and TAMB,EFF for the FPGA.

Figure 20. Calculating Effective Ambient Temperature and ΨCA
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