Video: Intel Introduces New RibbonFET and PowerVia Technologies

Key Points

  • Intel introduced RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method.

  • PowerVia is Intel’s unique industry-first implementation of backside power delivery, optimizing signal transmission by eliminating the need for power routing on the front side of the wafer.

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The technology delivers faster transistor switching speeds while achieving the same drive current as multiple fins in a smaller footprint. PowerVia is Intel’s unique industry-first implementation of backside power delivery, optimizing signal transmission by eliminating the need for power routing on the front side of the wafer.

Learn more from Intel’s “Intel Accelerated” Event ›