Video: Intel Introduces New RibbonFET and PowerVia Technologies

Key Points

  • Intel introduced RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method.

  • PowerVia is Intel’s unique industry-first implementation of backside power delivery, optimizing signal transmission by eliminating the need for power routing on the front side of the wafer.

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At its "Intel Accelerated" event on July 26, 2021, Intel introduced RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method. RibbonFET, Intel’s implementation of a gate-all-around transistor, will be the company’s first new transistor architecture since it pioneered FinFET.

The technology delivers faster transistor switching speeds while achieving the same drive current as multiple fins in a smaller footprint. PowerVia is Intel’s unique industry-first implementation of backside power delivery, optimizing signal transmission by eliminating the need for power routing on the front side of the wafer.

Learn more from Intel’s “Intel Accelerated” Event ›