Video: Intel Foveros Technology Explained

Key Points

  • Foveros enables Intel to build processors with compute tiles stacked vertically, rather than side-by-side, providing greater performance in a smaller. footprint.

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Intel's Foveros technology leverages wafer-level packaging capabilities to provide a first-of-its-kind 3D stacking solution. 

Foveros enables Intel to build processors with compute tiles stacked vertically, rather than side-by-side, providing greater performance in a smaller footprint. It also allows Intel to mix and match compute tiles to optimize for cost and power efficiency.

Learn more from Intel’s “Intel Accelerated” Event ›