News Release: Intel Accelerates Process and Packaging Innovations

Key Points

  • Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond

  • Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more than a decade, and PowerVia, an industry-first for backside power delivery

  • Continued leadership in advanced 3D packaging innovations with Foveros Omni and Foveros Direct

  • New node naming to create consistent framework, more accurate view of process nodes for customers and the industry as Intel enters the angstrom era of semiconductors

  • Strong momentum for Intel Foundry Services (IFS) with first customer announcements

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In addition to announcing RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method, the company highlighted its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), High Numerical Aperture (High NA) EUV. Intel is positioned to receive the first High NA EUV production tool in the industry.

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