In addition to announcing RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method, the company highlighted its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), High Numerical Aperture (High NA) EUV. Intel is positioned to receive the first High NA EUV production tool in the industry.
Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond
Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more than a decade, and PowerVia, an industry-first for backside power delivery
Continued leadership in advanced 3D packaging innovations with Foveros Omni and Foveros Direct
New node naming to create consistent framework, more accurate view of process nodes for customers and the industry as Intel enters the angstrom era of semiconductors
Strong momentum for Intel Foundry Services (IFS) with first customer announcements