Product Collection
Marketing Status
Launched
Launch Date
Q3'19
Lithography
14 nm

Resources

Logic Elements (LE)
2073000
Adaptive Logic Modules (ALM)
702720
Adaptive Logic Module (ALM) Registers
2810880
Fabric and I/O Phase-Locked Loops (PLLs)
16
Maximum Embedded Memory
239.5 Mb
Maximum High Bandwidth Memory (HBM)
8 GB
Digital Signal Processing (DSP) Blocks
3960
Digital Signal Processing (DSP) Format
Multiply and Accumulate, Variable Precision, Fixed Point (hard IP), Floating Point (hard IP)
Hard Memory Controllers
Yes
External Memory Interfaces (EMIF)
DDR, DDR2, DDR3, DDR4, Intel® Optane™ Persistent Memory, QDR II, QDR II+, RLDRAM II, RLDRAM 3

I/O Specifications

Maximum User I/O Count
612
I/O Standards Support
3.0 V to 3.3 V LVTTL, 1.2 V to 3.3V LVCMOS, SSTL, POD, HSTL, HSUL, Differential SSTL, Differential POD, Differential HSTL, Differential HSUL, LVDS, Mini-LVDS, RSDS, LVPECL
Maximum LVDS Pairs
306
Maximum Non-Return to Zero (NRZ) Transceivers
84
Maximum Non-Return to Zero (NRZ) Data Rate
28.9 Gbps
Maximum Pulse-Amplitude Modulation (PAM4) Transceivers
12
Maximum Pulse-Amplitude Modulation (PAM4) Data Rate
57.8 Gbps
Transceiver Protocol Hard IP
PCIe Gen3, PCIe Gen4, 10/25/100G Ethernet, UPI

Advanced Technologies

Hyper-Registers
Yes
FPGA Bitstream Security
Yes

Package Specifications

Package Options
F2597

Supplemental Information