Agilex™ 9 SoC FPGA Direct RF-Series
Direct RF-Series devices integrate FPGAs and industry-leading high-performance wideband data converters and medium-band data converters with hi-fidelity performance. These Direct RF SoC FPGAs use Intel 10 nm SuperFin process technology, Quad-core Arm processors, ultra-low converter interface latency, transceiver rates up to 58 Gbps, and provide high channel density packages to address difficult size, weight, and power constraints.
Agilex™ 9 SoC FPGA Direct RF-Series
Optimized Edge Solutions for Radio Frequency Applications
Up to eight channels of
64Gsps
ADC/DAC converters integrated with an SoC FPGA
Up to sixteen channels of
12Gsps
DAC converters and 20 channels of 4 Gsps ADC converters integrated with an SoC FPGA
Converters combined with up to
25
TFLOPS of digital signal processing performance (FP16)
Up to eight channels of
64Gsps
ADC/DAC converters integrated with an SoC FPGA
Up to sixteen channels of
12Gsps
DAC converters and 20 channels of 4 Gsps ADC converters integrated with an SoC FPGA
Converters combined with up to
25
TFLOPS of digital signal processing performance (FP16)
Game-Changing Analog-Enabled FPGA
Intel’s 3D heterogenous architecture quickly enables composable system solutions.
Radio Frequency FPGA Customer Testimonial
This video demonstrates how you can solve tomorrow’s challenging missions with composable system solutions.
Direct RF-Series FPGA Evaluation Platform Demo
Learn about the Direct RF-Series FPGA Evaluation Platform while gaining a brief market overview and using the platform to show three RF performance sweeps: ADC noise spectral density, ADC spurious free dynamic range, and DAC intermodulation distortion.
Benefits
High-Performance Wideband Frequency Agility
Multi-channel converters with an RF bandwidth of 36 GHz and an instantaneous RF bandwidth of 32 GHz provide the ability to retune receivers and transmitters quickly while providing simultaneous wideband and narrowband tracking.
Low Latency and Power Consumption
Embedded Multi-die Interconnect Bridge (EMIB) and Advanced Interconnect Bus (AIB) tile interconnect technology to integrate RF-capable ADCs and DACs with Agilex™ 9 FPGA monolithic die. With programmable hardened IP, provide low latency and power consumption when converting between the analog and digital domains.
Total Cost of Ownership and Risk
These devices significantly impact the system-level size and cost (eliminating a substantial amount of external analog circuitry, associated power supplies, cooling, and chassis). This integrated and digital solution increases system reliability, which lowers system costs. An RF tool chain integrated into Quartus® Prime Software will lower risk and time to market.
Use Cases and Applications
Delivering a Game-Changing Portfolio of Analog-Enabled FPGAs
Intel is continuing to work with leading makers of cutting-edge analog RF converters to develop ADC and DAC tiles that are compatible with Intel’s EMIB, AIB, and multichip innovative packaging technologies. The new analog-enabled Direct-RF Series FPGA portfolio provides concrete evidence that these technologies are ready and provide unique value to be able to tackle the toughest problems on the RF Edge.
Addressing Digital Beamforming Systems’ Needs
As today’s beamforming platforms demand more antenna elements, wider bandwidth “all-digital’ systems, and higher-performance processing for intelligent rapid decision-making at the edge–Direct RF FPGAs provide a mission-critical solution to address future threats. Wide RF bandwidth and high-performance FPGAs provide a revolutionary value towards providing Direct RF capability for radar and military EW applications.
Intel and DOD Deliver SHIP (State-of-the-art Heterogeneous Integration Prototype) Program devices to BAE Six Quarters Ahead of Schedule
Intel develops industry-leading multi-chip packaging enabling up to 10 times value to the defense industrial base–value including performance capability and mission time to market.
Key Features
Advanced Interconnect Bus (AIB)
AIB is a very wide, multi-channel, high-speed, low-power, and low-latency parallel bus with a simple clocked interface bus protocol designed specifically to meet the requirements for die-to-die interconnect. The CHIPs alliance has published AIB as a standard.
Embedded Multi-Die Interconnect Bridge (EMIB)
Low latency and low power solutions due to Embedded Multi-Die Interconnect Bridge (EMIB), Advanced Interconnect Bus (AIB) tile interconnect technology, high-performance ADC and DAC with hardened IP, and Agilex™ 9 FPGA monolithic die.
A Variety of Additional I/O Functionality
Different semiconductor chiplets or tiles can provide FPGAs with a variety of additional I/O functionality including high bandwidth memory (HBM) DRAM, PCIe 4.0 and 5.0, and 58/116 Gbps serial transceiver ports that allow these FPGAs to interface with a wide variety of devices.