Intel Agilex® 7 General-Purpose I/O User Guide: F-Series and I-Series

ID 683780
Date 4/19/2023

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4.3.2. SDM I/O Pins During Power Sequencing

F-Series and I-Series devices do not support hot-socketing and require a specific power sequence. Design your power supply solution to properly control the complete power sequence.

Adhere to the guidelines to prevent unnecessary current draw on the I/O pins located in the SDM I/O banks. These guidelines apply for unpowered, power up to POR, POR delay, POR delay to configuration, configuration, initialization, user mode, and power down device states.

  • The I/O pins in the SDM I/O banks can be tri-stated, driven to ground, or driven to the VCCIO_SDM level.
  • While the device is powering up or down, the input signals of an I/O pin, at all times, must not exceed the I/O buffer power supply rail of the bank where the I/O pin resides.
  • While the device is powering up, powering down, or not turned on, the SDM I/O pins can tolerate a maximum of 10 mA per pin and a total of 100 mA per SDM I/O bank.
  • After the device fully powers up, the voltage levels for the SDM I/O pins must not exceed the DC input voltage (VI) value.
Table 37.  Guideline Example
Condition Guideline
The VCCIO_SDM pin ramps up and at period X, the VCCIO_SDM voltage is 0.9 V. At period X, keep the signals driven by the device connected to the SDM I/O pin at a voltage of 0.9 V or lower.