Quartus® Prime Pro Edition User Guide: Power Analysis and Optimization
ID
683174
Date
5/28/2025
Public
1.3.2.1. Using Simulation Signal Activity Data in Power Analysis
1.3.2.2. Signal Activities from RTL (Functional) Simulation, Supplemented by Vectorless Estimation
1.3.2.3. Signal Activities from Vectorless Estimation and User-Supplied Input Pin Activities
1.3.2.4. Signal Activities from User Defaults Only
1.5.1. Complete Design Simulation Power Analysis Flow
1.5.2. Modular Design Simulation Power Analysis Flow
1.5.3. Multiple Simulation Power Analysis Flow
1.5.4. Overlapping Simulation Power Analysis Flow
1.5.5. Partial Design Simulation Power Analysis Flow
1.5.6. Vectorless Estimation Power Analysis Flow
2.4.1. Clock Power Management
2.4.2. Pipelining and Retiming
2.4.3. Architectural Optimization
2.4.4. I/O Power Guidelines
2.4.5. Dynamically Controlled On-Chip Terminations (OCT)
2.4.6. Memory Optimization (M20K/MLAB)
2.4.7. DDR Memory Controller Settings
2.4.8. DSP Implementation
2.4.9. Reducing High-Speed Tile (HST) Usage
2.4.10. Unused Transceiver Channels
2.4.11. Periphery Power reduction XCVR Settings
1. Power Analysis
Power consumption is a critical design consideration. When designing a PCB, you must determine the power consumption of the FPGA device to develop an accurate power budget, and to design the power supplies, voltage regulators, heat sink, and cooling system.
The Quartus® Prime software includes the Power Analyzer to help you to estimate the power consumption of your compiled design.
Power Analyzer Tool Settings
The Quartus® Prime Design Suite also provides the Early Power Estimator (EPE) spreadsheet for Arria® 10 devices, and the Power and Thermal Calculator for Agilex™ FPGA portfolio and Stratix® 10 devices to estimate power consumption calculated from your predicted design characteristics.
Power estimation and analysis allows you to confirm that your design does not exceed thermal or power supply requirements throughout the design process:
- Thermal—Thermal power is the power that dissipates as heat from the FPGA. Devices use a heatsink or fan to act as a cooling solution. This cooling solution must be sufficient to dissipate the heat that the device generates. Additionally, the computed junction temperature must fall within normal device specifications.
- Power supply—Power supply is the power that the device needs to operate. Power supplies must provide adequate current to support device operation.
Note: Do not use the results of the Power Analyzer as design specifications. You must also verify the actual power during device operation to account for actual environmental operating conditions.