Intel® NUC Kit NUC8i7HNK

Intel® NUC Kit NUC8i7HNK

Essentials

Product Collection
Intel® NUC Kit with 8th Generation Intel® Core™ Processors
Code Name
Products formerly HADES CANYON
Processor Included
Intel® Core™ i7-8705G Processor with Radeon™ RX Vega M GL graphics (8M Cache, up to 4.10 GHz)
Graphics Name‡
Radeon™ RX Vega M GL Graphics
Discrete Graphics
Radeon™ RX Vega M GL graphics
Board Number
NUC8i7HNB
Board Chipset
Mobile Intel® HM175 Chipset
Supported Operating Systems
Windows 10, 64-bit*, Windows Server 2016*
Recommended Customer Price
$737.98 - $740.44

Supplemental Information

Marketing Status
Discontinued
Launch Date
Q1'18
Warranty Period
3 yrs
Embedded Options Available
No
Datasheet
View now
Description
Other features: Includes 2x Thunderbolt 3 (40Gbps) via rear USB-C ports, SDXC card slot and front USB-A and USB-C ports w/ USB 3.1 Gen 2

CPU Specifications

Total Cores
4
Total Threads
8
Max Turbo Frequency
4.10 GHz
Processor Base Frequency
3.10 GHz

Memory & Storage

Max Memory Size (dependent on memory type)
32 GB
# of Memory Slots
2
Memory Types
DDR4-2400+ 1.2V SO-DIMM
Max # of Memory Channels
2
Max Memory Bandwidth
38.4 GB/s
ECC Memory Supported ‡
No
Internal Drive Form Factor
M.2 SSD
# of Internal Drives Supported
2
Removable Memory Card Slot
SDXC with UHS-I support
M.2 Card Slot (storage)
22x42/80, 22x80

I/O Specifications

Graphics Output
2x Mini-DP 1.2, 2x Thunderbolt 3, F+R HDMI 2.0a
# of Displays Supported ‡
6
# of Thunderbolt™ Ports
2x Thunderbolt™ 3
# of USB Ports
13
USB Configuration
F: USB3, 2x USB 3.1g2 (Type A and C); R: 4x USB3, 2x Thunderbolt3 (USB3.1g2); INT: 2x USB2, 2x USB3
USB Revision
2.0, 3.0, 3.1 Gen2
USB 2.0 Configuration (External + Internal)
0 + 2
USB 3.0 Configuration (External + Internal)
1F, 4R, 2i
Total # of SATA Ports
2
Max # of SATA 6.0 Gb/s Ports
2
RAID Configuration
2x M.2 SATA/PCIe SSD (RAID-0 RAID-1)
Audio (back channel + front channel)
7.1 digital; L+R+mic (F); L+R+TOSLINK (R)
S/PDIF Out Connector
TOSLINK
Integrated LAN
Intel® Ethernet Connection i219-LM and i210-AT
Wireless Included
Intel® Dual Band Wireless-AC 8265
Bluetooth Version
4.2
M.2 Card Slot (wireless)
2230
Consumer Infrared Rx Sensor
Yes
Additional Headers
CEC, 2x USB2.0, 2x USB 3.0, FRONT_PANEL

Expansion Options

PCI Express Revision
Gen3
PCI Express Configurations ‡
Dual M.2 slots with PCIe x4 lanes

Package Specifications

TDP
65 W
DC Input Voltage Supported
19 VDC
Chassis Dimensions
221 x 142 x 39mm
Board Form Factor
UCFF (5.5" x 8")

Advanced Technologies

Intel® HD Audio Technology
Yes
Intel® Rapid Storage Technology
Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Yes
Intel® Virtualization Technology (VT-x) ‡
Yes

Security & Reliability

Intel® Platform Trust Technology (Intel® PTT)
Yes
TPM
No
Intel® AES New Instructions
Yes

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.

Retail prices reported as of 01 Oct 2023 08:43:14 GMT

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