Intel® NUC Kit NUC8i7HNK

Intel® NUC Kit NUC8i7HNK

Essentials

Product Collection
Intel® NUC Kit with 8th Generation Intel® Core™ Processors
Code Name
Products formerly HADES CANYON
Marketing Status
Discontinued
Launch Date
Q1'18
Supported Operating Systems
Windows 10, 64-bit*, Windows Server 2016*
Board Number
NUC8i7HNB
Board Form Factor
UCFF (5.5" x 8")
Socket
Soldered-down BGA
Internal Drive Form Factor
M.2 SSD
# of Internal Drives Supported
2
TDP
65 W
DC Input Voltage Supported
19 VDC
Recommended Customer Price
$737.98 - $740.44
Board Chipset
Mobile Intel® HM175 Chipset
Processor Included
Intel® Core™ i7-8705G Processor with Radeon™ RX Vega M GL graphics (8M Cache, up to 4.10 GHz)
Total Cores
4
Total Threads
8
Processor Base Frequency
3.10 GHz
Lithography
14 nm
Max Turbo Frequency
4.10 GHz
Warranty Period
3 yrs

Supplemental Information

Embedded Options Available
No
Datasheet
View now
Description
Other features: Includes 2x Thunderbolt 3 (40Gbps) via rear USB-C ports, SDXC card slot and front USB-A and USB-C ports w/ USB 3.1 Gen 2

Memory & Storage

Max Memory Size (dependent on memory type)
32 GB
Memory Types
DDR4-2400+ 1.2V SO-DIMM
Max # of Memory Channels
2
Max Memory Bandwidth
38.4 GB/s
Max # of DIMMs
2
ECC Memory Supported ‡
No

Processor Graphics

Graphics Name‡
Radeon™ RX Vega M GL Graphics
Integrated Graphics ‡
Yes
Graphics Output
2x Mini-DP 1.2, 2x Thunderbolt 3, F+R HDMI 2.0a
# of Displays Supported ‡
6
Discrete Graphics
Radeon™ RX Vega M GL graphics

Expansion Options

PCI Express Revision
Gen3
PCI Express Configurations ‡
Dual M.2 slots with PCIe x4 lanes
Removable Memory Card Slot
SDXC with UHS-I support
M.2 Card Slot (wireless)
2230
M.2 Card Slot (storage)
22x42/80, 22x80

I/O Specifications

# of USB Ports
13
USB Configuration
F: USB3, 2x USB 3.1g2 (Type A and C); R: 4x USB3, 2x Thunderbolt3 (USB3.1g2); INT: 2x USB2, 2x USB3
USB Revision
2.0, 3.0, 3.1 Gen2
USB 2.0 Configuration (External + Internal)
0 + 2
USB 3.0 Configuration (External + Internal)
1F, 4R, 2i
Total # of SATA Ports
2
Max # of SATA 6.0 Gb/s Ports
2
RAID Configuration
2x M.2 SATA/PCIe SSD (RAID-0 RAID-1)
Audio (back channel + front channel)
7.1 digital; L+R+mic (F); L+R+TOSLINK (R)
Integrated LAN
Intel® Ethernet Connection i219-LM and i210-AT
Integrated Wireless‡
Intel® Wireless-AC 8265 + Bluetooth 4.2
Integrated Bluetooth
Yes
Consumer Infrared Rx Sensor
Yes
S/PDIF Out Connector
TOSLINK
Additional Headers
CEC, 2x USB2.0, 2x USB 3.0, FRONT_PANEL
# of Thunderbolt™ Ports
2x Thunderbolt™ 3

Package Specifications

Chassis Dimensions
221 x 142 x 39mm

Advanced Technologies

Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Yes
TPM
No
Intel® HD Audio Technology
Yes
Intel® Rapid Storage Technology
Yes
Intel® Virtualization Technology (VT-x) ‡
Yes
Intel® Platform Trust Technology (Intel® PTT)
Yes

Security & Reliability

Intel® AES New Instructions
Yes

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.

Retail prices reported as of 22 Mar 2023 14:56:40 GMT

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