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  • Brand Name: Core i9
  • Document Number: 123456
  • Code Name: Alder Lake
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Skylake H

The 6th generation Intel® Core™ processor family, formerly Skylake H-Series (Mobile) is manufactured on Intel’s latest 14 nm technology. Paired with an Intel® CM230 or 100 series chipset, these processors offer dramatically higher CPU and graphics performance compared to the previous generation. They provide a broad range of power options and new advanced features that boost edge-to-cloud performance for Internet of Things (IoT) designs. The 6th generation Intel® Core™ processor family maintains a standardized thermal envelope for 45W (cTDP 35W), 35W, and 25W remaining consistent with the previous processor generation. The new generation is ideal for a wide range of IoT applications, including retail transaction terminals, digital signage, military and aerospace systems, casino gaming, and industrial automation.

The Intel® Xeon® processor family is introducing ball grid array (BGA) parts for mobile workstation computing needs. The BGA parts are 45W (35W cTDP) and 25W. The Intel Xeon processor E3-1200 v5 product family offers numerous advancements over the previous generation making them ideal for a wide range of IoT applications, including industrial control and automation equipment, retail devices, and military, aerospace, and government systems.

  • Overview
  • Documentation
  • Tools, training & services
  • How to buy

Key features on Skylake H

  • Stunning visual performance
  • Power-efficient performance
  • Broad design range
  • Advanced security and manageability

Platform componets for Skylake H

  • Processors specifications
  • Chipsets specifications
Processor Name Ordering Code Cache Clock Speed Power Memory
Intel® Xeon® processor e3-1515M v5 JQ8066202193208 8 M 2.8 GHz 45 W (cTDP 35 W) DDR4-2133, LPDDR3-1866, DDR3L-1600
Intel® Xeon® processor e3-1505M v5 CL8066202191415 8 M 3.7 GHz 45 W (cTDP 35 W) DDR3L: 1600
DDR4: 2133
Intel® Xeon® processor e3-1505L v5  CL8066202399804 8 M 2.8 GHz 25 W DDR3L: 1600
DDR4: 2133
Intel® Core™ i7-6820EQ processor CL8066201939103 8 M 3.6 GHz 45 W (cTDP 35 W) DDR3L: 1600
DDR4: 2133
Intel® Core™ i7-6822EQ processor CL8066202302204 8 M 2.8 GHz 25 W DDR3L: 1600
DDR4: 2133
Intel® Core™ i5-6440EQ processor CL8066201939503 6 M 3.5 GHz 45 W (cTDP 35 W) DDR3L: 1600
DDR4: 2133
Intel® Core™ i5-6442EQ processor CL8066202400005 6 M 2.7 GHz 25 W DDR3L: 1600
DDR4: 2133
Intel® Core™ i3-6100E processor CL8066201939604 3 M 2.7 GHz 35 W DDR3L: 1600
DDR4: 2133
Intel® Core™ i3-6102E processor CL8066202400105 3 M 1.9 GHz 25 W DDR3L: 1600
DDR4: 2133
Intel® Celeron® processor G3900 CM8066201928610 2 M 2.8 GHz 51 W DDR4-1866/2133, DDR3L-1333/1600 
Intel® Celeron® processor G3902E CL8066202400204 2 M 1.6 GHz 25 W DDR4-1866/2133, DDR3L-1333/1600 
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Chipset Name Ordering Code Power Features
Intel® Q170 chipset
GLQ170
6 W Up to six SATA ports (6 Gbps); 14 total USB ports (up to 10 USB 3.0); up to 20 PCI Express* x1 gen 3.0 ports; 1x16, 2x8 or 1x8+2x4 PCI Express graphics support; memory channels/DIMM per channel = 2/2; support Intel® vPro™ technology
Intel® H110 chipset
GLH110
6 W Up to four SATA ports (6 Gbps); 10 total USB ports (up to 4 USB 3.0); up to six PCI Express* x1 gen 2.0 ports; 1 x 16 PCI Express graphics support; memory channels/DIMM per channel = 2/1 
Intel® C236 chipset
GLC236
6 W

Supports ECC and Intel® Active Management Technology 11.0; up to eight SATA ports (6 Gbps); 14 total USB ports (up to 10 USB 3.0); up to 20 PCI Express x1 Gen 3 ports; 1x16, 2x8 or 1x8+2x4 PCI Express graphics support; memory channels/DIMM per channel = 2/2 

Intel® CM236 chipset
GLCM236
3.7 W Supports ECC and Intel® Active Management Technology 11.0; up to eight SATA ports (6 Gbps); 14 total USB ports (up to 10 USB 3.0); up to 20 PCI Express x1 Gen 3 ports; 1x16, 2x8 or 1x8+2x4 PCI Express graphics support; memory channels/DIMM per channel = 2/2
View all Show less
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