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Peek Inside Intel Foundry Resources

 

 

TALKING TECH + INTEL TECHNOLOGY

The Road to Panther Lake:
Intel 18A Process Node

Panther Lake is the first processor to use the Intel 18A process node. Take a deeper look at this cutting-edge manufacturing technology and why it’s so important for next-gen processors in this episode of Talking Tech.

Hear about why we chose to implement two fundamentally new technologies in this node, debuting RibbonFET gate-all-around transistors and PowerVia backside power delivery and learn how to enable customers with EDA tools, the nuances of MIM capacitors, and what’s coming next with 18A-P and 18A-PT nodes. Ready to take the next step, contact Intel Foundry today.

 

Watch to learn more

 

 

 

 

 

 

Read the latest from Intel Foundry

Accelerating AI and HPC with advanced process and packaging technologies

Intel Foundry offers a unique portfolio of process nodes, technologies, and packaging solutions to help AI and HPC silicon companies scale their performance.

Advancing microelectronics for aerospace, defense, and government

Intel Foundry's process nodes, technologies, and packaging solutions enable high-performance analog/digital designs.

Intel 18A process node family

The Intel 18A process node family delivers an industry-first foundry platform built for modern compute workloads.

EMIB revolutionizes chip packaging interconnect technology

Discover how EMIB delivers high-bandwidth communications when integrating multiple dies (chips) into a single package.

Foveros 2.5D packaging technology enables complex chip designs

Foveros 2.5D advanced packaging technology enables more compact chip designs, with chip-on-chip bonding for interconnect density.

Foveros Direct 3D revolutionizes chip integration for AI and HPC

Foveros Direct 3D advanced packaging technology uses ultra-high density interconnects via direct copper-to-copper bonding to enable increased performance.

Cutting-Edge Process Technologies for Data Center

Intel Xeon 6+ processors, formerly codenamed Clearwater Forest, deliver Intel 18A and advanced chiplet packaging to the data center.

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