3.2.2. Security Device Manager (SDM)

Intel® Simics® Simulator for Intel® FPGAs: Agilex™ 5 E-Series Virtual Platform User Guide

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ID 786901

Date 4/01/2024

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Document Table of Contents

Document Table of Contents x

1. About This Document 2. Agilex™ 5 E-Series Intel® Simics® Virtual Platforms 3. Agilex™ 5 E-Series Virtual Platform Component Intel® Simics® Models 4. Running a Simulation with the Agilex™ 5 E-Series HPS Model 5. Supported Use Cases 6. Troubleshooting Issues When Migrating Software from Intel® Simics® to Hardware A. Document Revision History

1. About This Document x

1.1. Terminology 1.2. List of Acronyms

2. Agilex™ 5 E-Series Intel® Simics® Virtual Platforms x

2.1. Agilex™ 5 E-Series Universal Virtual Platform

2.1. Agilex™ 5 E-Series Universal Virtual Platform x

2.1.1. Agilex™ 5 E-Series Universal Virtual Platform Overview 2.1.2. Agilex™ 5 E-Series Universal Virtual Platform User-Configurable Parameters 2.1.3. Agilex™ 5 E-Series Virtual Platform Key Capabilities

2.1.1. Agilex™ 5 E-Series Universal Virtual Platform Overview x

2.1.1.1. Agilex™ 5 HPS Component 2.1.1.2. HPS Subsystem Component 2.1.1.3. FPGA Fabric Design 2.1.1.4. qsys_top Component 2.1.1.5. FPGA Component 2.1.1.6. Board Component 2.1.1.7. System Component 2.1.1.8. Target Script

2.1.3. Agilex™ 5 E-Series Virtual Platform Key Capabilities x

2.1.3.1. Boot-To-Operating System Prompt 2.1.3.2. Basic Ethernet 2.1.3.3. CPU Power-On and Boot Core Selection 2.1.3.4. Reset Flow 2.1.3.5. General Purpose I/O (GPIO) Loopback 2.1.3.6. USB Disks Hot-Plug Support 2.1.3.7. On-Chip Memory IP FPGA Fabric Example Design 2.1.3.8. FPGA-to-HPS Bridges 2.1.3.9. Exercising Peripheral Subsystem in FPGA Fabric Design 2.1.3.10. USB Controller Host/Device Mode Configuration 2.1.3.11. B0 Silicon Features Selection

3. Agilex™ 5 E-Series Virtual Platform Component Intel® Simics® Models x

3.1. Agilex™ 5 E-Series HPS Intel® Simics® Model 3.2. Virtual Platform HPS Subsystem Components 3.3. Virtual Platform qsys_top Components 3.4. Virtual Platform Board Components 3.5. Modeling Support Limitations

3.1. Agilex™ 5 E-Series HPS Intel® Simics® Model x

3.1.1. Agilex™ 5 E-Series HPS Intel® Simics® Model Architecture 3.1.2. PSS Subsystem Components 3.1.3. MPU and APS Subsystem 3.1.4. MPFE Subsystem 3.1.5. Additional Agilex™ 5 E-Series HPS Components 3.1.6. Agilex™ 5 E-Series B0 Features Support

3.2. Virtual Platform HPS Subsystem Components x

3.2.1. External Memory Interface (EMIF) 3.2.2. Security Device Manager (SDM)

3.3. Virtual Platform qsys_top Components x

3.3.1. FPGA Fabric

3.4. Virtual Platform Board Components x

3.4.1. Marvel EMAC PHY 3.4.2. SD Card Device 3.4.3. ONFI NAND Memory Device 3.4.4. SPI Flash Device 3.4.5. AT24Cxx EEPROM Device 3.4.6. I3C Device 3.4.7. USB Disk Device 3.4.8. Intel® Simics® Text Console

4. Running a Simulation with the Agilex™ 5 E-Series HPS Model x

4.1. Prerequisites 4.2. Intel® Simics® Simulation Setup for the Agilex™ 5 E-Series Device 4.3. Starting the Simulation 4.4. Getting Device Information from the Intel® Simics® Model

1. About This Document

1.1. Terminology

1.2. List of Acronyms

2. Agilex™ 5 E-Series Intel® Simics® Virtual Platforms

2.1. Agilex™ 5 E-Series Universal Virtual Platform

2.1.1. Agilex™ 5 E-Series Universal Virtual Platform Overview

2.1.1.1. Agilex™ 5 HPS Component

2.1.1.2. HPS Subsystem Component

2.1.1.3. FPGA Fabric Design

2.1.1.4. qsys_top Component

2.1.1.5. FPGA Component

2.1.1.6. Board Component

2.1.1.7. System Component

2.1.1.8. Target Script

2.1.2. Agilex™ 5 E-Series Universal Virtual Platform User-Configurable Parameters

2.1.3. Agilex™ 5 E-Series Virtual Platform Key Capabilities

2.1.3.1. Boot-To-Operating System Prompt

2.1.3.2. Basic Ethernet

2.1.3.3. CPU Power-On and Boot Core Selection

2.1.3.4. Reset Flow

2.1.3.5. General Purpose I/O (GPIO) Loopback

2.1.3.6. USB Disks Hot-Plug Support

2.1.3.7. On-Chip Memory IP FPGA Fabric Example Design

2.1.3.8. FPGA-to-HPS Bridges

2.1.3.9. Exercising Peripheral Subsystem in FPGA Fabric Design

2.1.3.10. USB Controller Host/Device Mode Configuration

2.1.3.11. B0 Silicon Features Selection

3. Agilex™ 5 E-Series Virtual Platform Component Intel® Simics® Models

3.1. Agilex™ 5 E-Series HPS Intel® Simics® Model

3.1.1. Agilex™ 5 E-Series HPS Intel® Simics® Model Architecture

3.1.2. PSS Subsystem Components

3.1.3. MPU and APS Subsystem

3.1.4. MPFE Subsystem

3.1.5. Additional Agilex™ 5 E-Series HPS Components

3.1.6. Agilex™ 5 E-Series B0 Features Support

3.2. Virtual Platform HPS Subsystem Components

3.2.1. External Memory Interface (EMIF)

3.2.2. Security Device Manager (SDM)

3.3. Virtual Platform qsys_top Components

3.3.1. FPGA Fabric

3.4. Virtual Platform Board Components

3.4.1. Marvel EMAC PHY

3.4.2. SD Card Device

3.4.3. ONFI NAND Memory Device

3.4.4. SPI Flash Device

3.4.5. AT24Cxx EEPROM Device

3.4.6. I3C Device

3.4.7. USB Disk Device

3.4.8. Intel® Simics® Text Console

3.5. Modeling Support Limitations

4. Running a Simulation with the Agilex™ 5 E-Series HPS Model

4.1. Prerequisites

4.2. Intel® Simics® Simulation Setup for the Agilex™ 5 E-Series Device

4.3. Starting the Simulation

4.4. Getting Device Information from the Intel® Simics® Model

5. Supported Use Cases

6. Troubleshooting Issues When Migrating Software from Intel® Simics® to Hardware

A. Document Revision History