Intel Agilex® 7 LVDS SERDES User Guide: F-Series and I-Series

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ID 721819
Date 4/10/2023
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Document Table of Contents
Document Table of Contents x
1. Intel Agilex® 7 F-Series and I-Series LVDS SERDES Overview 2. Intel Agilex® 7 F-Series and I-Series High-Speed SERDES Architecture 3. Intel Agilex® 7 F-Series and I-Series LVDS SERDES Transmitter 4. Intel Agilex® 7 F-Series and I-Series LVDS SERDES Receiver 5. Intel Agilex® 7 F-Series and I-Series High-Speed LVDS I/O Implementation Guide 6. Intel Agilex® 7 F-Series and I-Series LVDS SERDES Timing 7. LVDS SERDES Intel® FPGA IP Design Examples 8. Intel Agilex® 7 F-Series and I-Series High-Speed SERDES Design Guidelines 9. Intel Agilex® 7 F-Series and I-Series High-Speed SERDES Troubleshooting Guidelines 10. Documentation Related to the Intel Agilex® 7 LVDS SERDES User Guide: F-Series and I-Series 11. Document Revision History for the Intel Agilex® 7 LVDS SERDES User Guide: F-Series and I-Series
1. Intel Agilex® 7 F-Series and I-Series LVDS SERDES Overview x
1.1. High-Speed SERDES Usage Modes
2. Intel Agilex® 7 F-Series and I-Series High-Speed SERDES Architecture x
2.1. F-Series and I-Series GPIO Banks, SERDES, and DPA Locations 2.2. SERDES Blocks, Modes, and Clock Domains
3. Intel Agilex® 7 F-Series and I-Series LVDS SERDES Transmitter x
3.1. LVDS SERDES Transmitter Blocks 3.2. Serializer 3.3. Differential I/O Bit Position 3.4. Clocking the Differential Transmitters
3.2. Serializer x
3.2.1. Serializer Bypass for DDR and SDR Operations
3.4. Clocking the Differential Transmitters x
3.4.1. Transmitter Output Clock Parameters Settings
3.4.1. Transmitter Output Clock Parameters Settings x
3.4.1.1. Edge-Aligned tx_outclock to tx_out 3.4.1.2. Center-Aligned tx_outclock to tx_out
4. Intel Agilex® 7 F-Series and I-Series LVDS SERDES Receiver x
4.1. LVDS SERDES Receiver Blocks 4.2. Clocking the LVDS SERDES Receivers 4.3. LVDS SERDES Receiver Modes
4.1. LVDS SERDES Receiver Blocks x
4.1.1. Dynamic Phase Alignment Block 4.1.2. Synchronizer (DPA FIFO) 4.1.3. Data Realignment Block (Bit Slip) 4.1.4. Deserializer
4.2. Clocking the LVDS SERDES Receivers x
4.2.1. Receiver Input Clock Parameters Settings
4.2.1. Receiver Input Clock Parameters Settings x
4.2.1.1. Edge-Aligned inclock to rx_in 4.2.1.2. Center-Aligned inclock to rx_in
4.3. LVDS SERDES Receiver Modes x
4.3.1. Non-DPA Mode 4.3.2. DPA Mode 4.3.3. Soft-CDR Mode
5. Intel Agilex® 7 F-Series and I-Series High-Speed LVDS I/O Implementation Guide x
5.1. LVDS SERDES Intel® FPGA IP 5.2. LVDS Interface with External PLL Mode 5.3. LVDS SERDES IP Initialization and Reset
5.1. LVDS SERDES Intel® FPGA IP x
5.1.1. Release Information 5.1.2. LVDS SERDES Intel® FPGA IP Features 5.1.3. LVDS SERDES IP Usage Modes 5.1.4. Generating the LVDS SERDES Intel® FPGA IP 5.1.5. LVDS SERDES Intel® FPGA IP Parameter Settings 5.1.6. LVDS SERDES Intel® FPGA IP Signals
5.1.4. Generating the LVDS SERDES Intel® FPGA IP x
5.1.4.1. Intel® FPGA IP Generation Output
5.1.5. LVDS SERDES Intel® FPGA IP Parameter Settings x
5.1.5.1. LVDS SERDES Intel® FPGA IP General Settings 5.1.5.2. LVDS SERDES Intel® FPGA IP PLL Settings 5.1.5.3. LVDS SERDES Intel® FPGA IP Receiver Settings 5.1.5.4. LVDS SERDES Intel® FPGA IP Transmitter Settings 5.1.5.5. LVDS SERDES Intel® FPGA IP Clock Resource Summary
5.2. LVDS Interface with External PLL Mode x
5.2.1. IOPLL IP Signal Interface with LVDS SERDES IP 5.2.2. IOPLL Parameter Values for External PLL Mode 5.2.3. Connection between IOPLL IP and LVDS SERDES IP in External PLL Mode
5.3. LVDS SERDES IP Initialization and Reset x
5.3.1. Initializing the LVDS SERDES IP in Non-DPA Mode 5.3.2. Initializing the LVDS SERDES IP in DPA Mode 5.3.3. Resetting the DPA 5.3.4. Word Boundaries Alignment
5.3.4. Word Boundaries Alignment x
5.3.4.1. Aligning Word Boundaries
6. Intel Agilex® 7 F-Series and I-Series LVDS SERDES Timing x
6.1. LVDS SERDES Intel® FPGA IP Timing 6.2. LVDS SERDES Source-Synchronous Timing Budget
6.1. LVDS SERDES Intel® FPGA IP Timing x
6.1.1. I/O Timing Analysis 6.1.2. FPGA Timing Analysis 6.1.3. Timing Analysis for the External PLL Mode
6.1.1. I/O Timing Analysis x
6.1.1.1. Obtaining RSKM Report 6.1.1.2. Obtaining TCCS Report
6.2. LVDS SERDES Source-Synchronous Timing Budget x
6.2.1. Transmitter Channel-to-Channel Skew 6.2.2. Receiver Skew Margin
7. LVDS SERDES Intel® FPGA IP Design Examples x
7.1. LVDS SERDES IP Synthesizable Intel® Quartus® Prime Design Examples 7.2. LVDS SERDES IP Simulation Design Example
8. Intel Agilex® 7 F-Series and I-Series High-Speed SERDES Design Guidelines x
8.1. Use PLLs in Integer PLL Mode for LVDS 8.2. Use High-Speed Clock from PLL to Clock SERDES Only 8.3. Pin Placement for Differential Channels 8.4. SERDES Pin Pairs for Soft-CDR Mode 8.5. Placing LVDS Transmitters and Receivers in the Same GPIO Bank
1. Intel Agilex® 7 F-Series and I-Series LVDS SERDES Overview
2. Intel Agilex® 7 F-Series and I-Series High-Speed SERDES Architecture
3. Intel Agilex® 7 F-Series and I-Series LVDS SERDES Transmitter
4. Intel Agilex® 7 F-Series and I-Series LVDS SERDES Receiver
5. Intel Agilex® 7 F-Series and I-Series High-Speed LVDS I/O Implementation Guide
6. Intel Agilex® 7 F-Series and I-Series LVDS SERDES Timing
7. LVDS SERDES Intel® FPGA IP Design Examples
8. Intel Agilex® 7 F-Series and I-Series High-Speed SERDES Design Guidelines
9. Intel Agilex® 7 F-Series and I-Series High-Speed SERDES Troubleshooting Guidelines
10. Documentation Related to the Intel Agilex® 7 LVDS SERDES User Guide: F-Series and I-Series
11. Document Revision History for the Intel Agilex® 7 LVDS SERDES User Guide: F-Series and I-Series

2.1. F-Series and I-Series GPIO Banks, SERDES, and DPA Locations

The GPIO banks are located at the top and bottom I/O bank rows.
Figure 1.  GPIO Bank Structure (Die Top View)This figure shows the GPIO bank structure of F-Series and I-Series devices. The figure shows the view of the die as shown in the Intel® Quartus® Prime Chip Planner. In the Pin Planner, this corresponds to the "Bottom View". Different device packages have different number of GPIO banks. Refer to the device pin-out files for available GPIO banks and the locations of the SDM shared and HPS shared GPIO banks for each device package.
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