External Memory Interfaces Intel® Agilex™ FPGA IP Core Release Notes

ID 683334
Date 12/18/2020
Public

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1.3. External Memory Interfaces Intel Agilex FPGA IP v2.0.0

Table 13.  v2.0.0 2019.12.16
Description Impact
Verified in the Intel® Quartus® Prime software v19.4. Provides external memory interface IP for DDR4 external memory for Intel® Agilex™ devices. The tables that follow summarize speed and feature support.
Table 14.  Agilex Fabric EMIF IP Speed Support Summary
      Max Rate (Mbps/MHz)   -1 -2 -3
Protocol Category Subcategory -1 -2 -3 Support Detail S C T H S C T H S C T H
DDR4 Memory Format UDIMM 3200/1600 (1R) 2666/1333 (1R) 2400/1200 (1R)   X X X up to 1200 MHz X X X X
2666/1333 (2R) 2400/1200 (2R) 2133/1067 (2R)   X X X   X X X  
2666/1333 (R+R) 2400/1200 (R+R) 2133/1067 (R+R)                  
2133/1067 (2R+2R) 1866/933 (2R+2R) 1600/800 (2R+2R)                  
RDIMM 3200/1600 (1R) 2666/1333 (1R) 2400/1200 (1R) non-3DS X X X up to 1200 MHz X X X X
2666/1333 (2R) 2400/1200 (2R) 2133/1067 (2R) non-3DS X X X   X X X  
2666/1333 (R+R) 2400/1200 (R+R) 2133/1067 (R+R) non-3DS X X X   X X X  
2133/1067 (2R+2R) 1866/933 (2R+2R) 1600/800 (2R+2R) non-3DS              
2666/1333 (2R) 2400/1200 (2R) 2133/1067 (2R) 3DS(2H & 4H)
2133/1067 (2R+2R) 1866/933 (2R+2R) 1600/800 (2R+2R) 3DS(2H & 4H)
Component 3200/1600 (1R) 2666/1333 (1R) 2400/1200 (1R) x8,x4,x16,3DS, 1R Clamshell, 1R Twin-Die x16 X X X up to 1200 MHz X X X X
2666/1333 (2R) 2666/1333 (2R) 2400/1200 (2R) x8, x4, x16                
2666/1333 (2R) 2666/1333 (2R) 2400/1200 (2R) Clamshell 2R              
Support level key:
  • S = simulation support
  • C = compilation support
  • T = timing support
  • H = hardware support

  • X = supported feature.
  • An empty table cell indicates that the feature is not currently supported.
Table 15.  Agilex HPS EMIF IP Speed Support Summary
      Max Rate (Mbps/MHz)   -1 -2 -3
Protocol Category Subcategory -1 -2 -3 Support Detail S C T H S C T H S C T H
DDR4 Memory Format UDIMM 3200/1600 (1R) 2666/1333 (1R) 2400/1200 (1R)   X X X up to 1200 MHz X X X X
SODIMM 3200/1600 (1R) 2666/1333 (1R) 2400/1200 (1R)   X X X X X X X X
RDIMM 3200/1600 (1R) 2666/1333 (1R) 2400/1200 (1R) non-3DS X X X up to 1200 MHz X X X X
2666/1333 (2R) 2400/1200 (2R) 2133/1067 (2R) non-3DS X X X   X X X  
Component 3200/1600 (1R) 2666/1333 (1R) 2400/1200 (1R) x8,x4,x16,3DS, 1R Clamshell, 1R Twin-Die x16 X X X up to 1200 MHz X X X X
2666/1333 (2R) 2666/1333 (2R) 2400/1200 (2R) x8, x4, x16, clamshell                
Support level key:
  • S = simulation support
  • C = compilation support
  • T = timing support
  • H = hardware support

  • X = supported feature.
  • An empty table cell indicates that the feature is not currently supported.
Table 16.  Agilex EMIF IP Feature Support Summary
         
Protocol Category Subcategory Supported? S C T H
DDR4 Interface Width <=72 with DIMM X X X X X
<= 72 Component X X X X X
Controller Hard Controller X X X X X
PHY Hard PHY X X X X X
3DS 3DS X (1D2R only) X X X  
Design example X X X X X
Rate (core) Quarter Rate X X X X X
DBI Read DBI X X X X X
Write DBI X X X X X
Mirroring Address mirroring for odd ranks for multi ranks DIMM X X X X X
DM DM Pins X X X X X
Preamble Read Preamble Settings X X X X X
Write Preamble Settings X X X X X
Refresh1 Temperature Controlled Refresh
Fine Granularity Refresh
Auto Self-refresh Method
Self-refresh
ODT1 Input Buffer During Power-down Mode
Controller ECC X X X X X
Reordering X X X X X
Auto Power-down X X X X
User Refresh
Auto Precharge X X X
Command Priority
Calibration Address/Command Calibration X X X X X
Multi-rank Calibration X X X X X
Debug EMIF Toolkit X X X X
Note1: Feature not validated in hardware.
Support level key:
  • S = simulation support
  • C = compilation support
  • T = timing support
  • H = hardware support

  • X = supported feature.
  • An empty table cell indicates that the feature is not currently supported.
Table 17.  Agilex EMIF HPS IP Feature Support Summary
         
Protocol Category Subcategory Supported? S C T H
DDR4 Interface Width <=72 with DIMM X   X X X
<= 72 Component X   X X X
Controller Hard Controller X   X X X
PHY Hard PHY X   X X X
Rate (core) Quarter Rate X   X X X
DM DM Pins1 X   X X X
Preamble Read Preamble Settings X   X X X
Write Preamble Settings X   X X X
Refresh2 Temperature Controlled Refresh
Fine Granularity Refresh
Auto Self-refresh Method
Self-refresh About
ODT2 Input Buffer During Power-down Mode
Controller ECC        
Reordering X   X X X
Auto Power-down X   X X
Calibration Address/Command Calibration X   X X X
Debug EMIF Toolkit
  • Note1: HPS EMIF always requires DM pins.
  • Note2: Feature not validated in hardware.
Support level key:
  • S = simulation support
  • C = compilation support
  • T = timing support
  • H = hardware support

  • X = supported feature.
  • An empty table cell indicates that the feature is not currently supported.
Table 18.  Agilex EMIF IP Debug Support Summary
Category Subcategory Supported?
Debug Support On-chip Debug On-chip Debug with Soft Nios®
EMIF Toolkit Calibration Margin X
Rerun Calibration X
Vref Margining
Driver Margining X
Efficiency Monitor
ODT Calibration X
Multi-interface Support X
  • X = supported feature.
  • An empty table cell indicates that the feature is not currently supported.