1.3. External Memory Interfaces Intel Agilex FPGA IP v2.0.0
Description | Impact |
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Verified in the Intel® Quartus® Prime software v19.4. | Provides external memory interface IP for DDR4 external memory for Intel® Agilex™ devices. The tables that follow summarize speed and feature support. |
Max Rate (Mbps/MHz) | -1 | -2 | -3 | |||||||||||||||
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Protocol | Category | Subcategory | -1 | -2 | -3 | Support Detail | S | C | T | H | S | C | T | H | S | C | T | H |
DDR4 | Memory Format | UDIMM | 3200/1600 (1R) | 2666/1333 (1R) | 2400/1200 (1R) | X | X | X | up to 1200 MHz | X | X | X | X | |||||
2666/1333 (2R) | 2400/1200 (2R) | 2133/1067 (2R) | X | X | X | X | X | X | ||||||||||
2666/1333 (R+R) | 2400/1200 (R+R) | 2133/1067 (R+R) | ||||||||||||||||
2133/1067 (2R+2R) | 1866/933 (2R+2R) | 1600/800 (2R+2R) | ||||||||||||||||
RDIMM | 3200/1600 (1R) | 2666/1333 (1R) | 2400/1200 (1R) | non-3DS | X | X | X | up to 1200 MHz | X | X | X | X | ||||||
2666/1333 (2R) | 2400/1200 (2R) | 2133/1067 (2R) | non-3DS | X | X | X | X | X | X | |||||||||
2666/1333 (R+R) | 2400/1200 (R+R) | 2133/1067 (R+R) | non-3DS | X | X | X | X | X | X | |||||||||
2133/1067 (2R+2R) | 1866/933 (2R+2R) | 1600/800 (2R+2R) | non-3DS | |||||||||||||||
2666/1333 (2R) | 2400/1200 (2R) | 2133/1067 (2R) | 3DS(2H & 4H) | |||||||||||||||
2133/1067 (2R+2R) | 1866/933 (2R+2R) | 1600/800 (2R+2R) | 3DS(2H & 4H) | |||||||||||||||
Component | 3200/1600 (1R) | 2666/1333 (1R) | 2400/1200 (1R) | x8,x4,x16,3DS, 1R Clamshell, 1R Twin-Die x16 | X | X | X | up to 1200 MHz | X | X | X | X | ||||||
2666/1333 (2R) | 2666/1333 (2R) | 2400/1200 (2R) | x8, x4, x16 | |||||||||||||||
2666/1333 (2R) | 2666/1333 (2R) | 2400/1200 (2R) | Clamshell 2R | |||||||||||||||
Support level key:
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Max Rate (Mbps/MHz) | -1 | -2 | -3 | |||||||||||||||
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Protocol | Category | Subcategory | -1 | -2 | -3 | Support Detail | S | C | T | H | S | C | T | H | S | C | T | H |
DDR4 | Memory Format | UDIMM | 3200/1600 (1R) | 2666/1333 (1R) | 2400/1200 (1R) | X | X | X | up to 1200 MHz | X | X | X | X | |||||
SODIMM | 3200/1600 (1R) | 2666/1333 (1R) | 2400/1200 (1R) | X | X | X | X | X | X | X | X | |||||||
RDIMM | 3200/1600 (1R) | 2666/1333 (1R) | 2400/1200 (1R) | non-3DS | X | X | X | up to 1200 MHz | X | X | X | X | ||||||
2666/1333 (2R) | 2400/1200 (2R) | 2133/1067 (2R) | non-3DS | X | X | X | X | X | X | |||||||||
Component | 3200/1600 (1R) | 2666/1333 (1R) | 2400/1200 (1R) | x8,x4,x16,3DS, 1R Clamshell, 1R Twin-Die x16 | X | X | X | up to 1200 MHz | X | X | X | X | ||||||
2666/1333 (2R) | 2666/1333 (2R) | 2400/1200 (2R) | x8, x4, x16, clamshell | |||||||||||||||
Support level key:
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Protocol | Category | Subcategory | Supported? | S | C | T | H |
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DDR4 | Interface Width | <=72 with DIMM | X | X | X | X | X |
<= 72 Component | X | X | X | X | X | ||
Controller | Hard Controller | X | X | X | X | X | |
PHY | Hard PHY | X | X | X | X | X | |
3DS | 3DS | X (1D2R only) | X | X | X | ||
Design example | X | X | X | X | X | ||
Rate (core) | Quarter Rate | X | X | X | X | X | |
DBI | Read DBI | X | X | X | X | X | |
Write DBI | X | X | X | X | X | ||
Mirroring | Address mirroring for odd ranks for multi ranks DIMM | X | X | X | X | X | |
DM | DM Pins | X | X | X | X | X | |
Preamble | Read Preamble Settings | X | X | X | X | X | |
Write Preamble Settings | X | X | X | X | X | ||
Refresh1 | Temperature Controlled Refresh | ||||||
Fine Granularity Refresh | |||||||
Auto Self-refresh Method | |||||||
Self-refresh | |||||||
ODT1 | Input Buffer During Power-down Mode | ||||||
Controller | ECC | X | X | X | X | X | |
Reordering | X | X | X | X | X | ||
Auto Power-down | X | X | X | X | |||
User Refresh | |||||||
Auto Precharge | X | X | X | ||||
Command Priority | |||||||
Calibration | Address/Command Calibration | X | X | X | X | X | |
Multi-rank Calibration | X | X | X | X | X | ||
Debug | EMIF Toolkit | X | X | X | X | ||
Note1: Feature not validated in hardware. | |||||||
Support level key:
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Protocol | Category | Subcategory | Supported? | S | C | T | H |
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DDR4 | Interface Width | <=72 with DIMM | X | X | X | X | |
<= 72 Component | X | X | X | X | |||
Controller | Hard Controller | X | X | X | X | ||
PHY | Hard PHY | X | X | X | X | ||
Rate (core) | Quarter Rate | X | X | X | X | ||
DM | DM Pins1 | X | X | X | X | ||
Preamble | Read Preamble Settings | X | X | X | X | ||
Write Preamble Settings | X | X | X | X | |||
Refresh2 | Temperature Controlled Refresh | ||||||
Fine Granularity Refresh | |||||||
Auto Self-refresh Method | |||||||
Self-refresh About | |||||||
ODT2 | Input Buffer During Power-down Mode | ||||||
Controller | ECC | ||||||
Reordering | X | X | X | X | |||
Auto Power-down | X | X | X | ||||
Calibration | Address/Command Calibration | X | X | X | X | ||
Debug | EMIF Toolkit | ||||||
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Support level key:
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Category | Subcategory | Supported? | |
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Debug Support | On-chip Debug | On-chip Debug with Soft Nios® | |
EMIF Toolkit | Calibration Margin | X | |
Rerun Calibration | X | ||
Vref Margining | |||
Driver Margining | X | ||
Efficiency Monitor | |||
ODT Calibration | X | ||
Multi-interface Support | X | ||
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