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Technical Specifications

Essentials

Status
Launched
Launch Date
Q1'13
Expected Discontinuance
Q1'21
Lithography
TDP
195 W

Networking Specifications

Maximum Port Bandwidth
640 G
Maximum SGMII Ports
72
Maximum XAUI Ports
24
Maximum 10G KR Ports
64
Maximum 40G KR4 Ports
16
Cut-Through Latency
400 ns
Frame Processing Rate
960 M pps
Shared Packet Memory Size
8 MB
Traffic Classes
8
MAC Table Size
64 K
ACL Rules
24 K
IPv4/IPv6 Routes
64K/16K
Intel® FlexPipe™ Technology
Yes
Advanced Load Balancing
Yes
CEE/DCB Features
Yes
Server Virtualization Support
Yes
Advanced Tunneling Features
Yes
Carrier Ethernet Support
No
CPU Interface
PCIe, EBI
Applications
Data Center,FSI,HPC

Package Specifications

Extended Temperature Options
No
Package Size
42.5mm x 42.5mm

Reviews

Product and Performance Information

This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.