Build Transformative Solutions for the Intelligent IoT Edge

Next-gen Intel® Xeon® D processors bring server-class performance in two form factors tailored to meet the growing demands of compute at the edge.


  • Support edge computing with IoT-centric features including built-in AI acceleration, high-capacity I/Os, and hardware-based security.

  • Intel® Xeon® D-1700 and D-2700 processors feature Intel® Deep Learning Boost, Intel® Time Coordinated Computing, and Intel® Speed Select Technology.1

  • These processors are ideal for embedded servers as well as rugged applications at the edge or in extreme environments that require high-performance compute.



Extended operating temperature ranges1 and industrial-class reliability make Intel Xeon D-1700 and D-2700 processors ideal for high-performance, soldered-down designs. They are suitable for rugged equipment, small form factors, and sealed fanless devices that must run nonstop in the toughest environments.

Accelerate deep learning AI workloads

The platform includes integrated hardware acceleration for deep learning inference—Intel® Deep Learning Boost (Intel® DL Boost). Intel DL Boost combines three Intel® Advanced Vector Extensions (Intel® AVX) instructions into one, which speeds processing of int8 workloads. To take advantage of Intel DL Boost, use the Intel® Distribution of OpenVINO™ toolkit to tune and optimize deep learning models.

Run hard real-time workloads faster and more predictably

Available on select processors, Intel® Time Coordinated Computing (Intel® TCC)1 improves performance for latency-sensitive applications at the system level. Intel TCC includes a toolkit for tuning the system and creating precise time and task management for systems running real-time hypervisors.

Fine-tune CPU performance for multiple concurrent workloads

Intel® Speed Select Technology (Intel® SST)1 provides precise control over per-core throughput and performance, including base frequency and frequency prioritization at the CPU core level. It supports performance profiles that allow you to configure a single CPU to run multiple workloads with a mix of critical priorities for specific processes like factory operations, command and control systems, or business processes.

Consolidating workloads reduces the number of systems you need to certify, which can lower your bill of materials. For critical applications, the processors’ high core counts give systems the resources they need to run multiple redundant versions of the same system for error checking and failover support.

Build a more secure edge with hardware-based security

Embedded devices are vulnerable to weaknesses in the network and on-site physical tampering. To help combat these threats, Intel Xeon D-1700 and D-2700 processors have hardware-based security measures. The measures can help reduce your physical and cyberattack surface and help prevent memory snooping in edge deployments.2

Split cores for multiple workloads and more-robust systems

With options from four cores up to 20 cores, Intel Xeon D-1700 and D-2700 processors can run multiple virtual machines, operating systems, and control systems. Multi-OS support—including real-time operating systems, hypervisor support, and multiple Intel® technologies for fine-tuning CPU performance—lets you consolidate multiple disparate workloads onto a single device.

Support high-bandwidth networks and peripherals

Large video systems, automated manufacturing lines, and high-speed communications devour bandwidth. Intel Xeon D-1700 and D-2700 processors meet this demand with integrated 50Gb or 100Gb Ethernet and up to 56 high-speed PCIe lanes—including up to 32 PCIe 4.0 and 24 configurable PCIe 3.0 lanes.1

Top use cases for Intel Xeon D-1700 and D-2700 processors1

The combination of AI acceleration, real-time capabilities, and high-speed I/Os in a high-density BGA package makes these processors ideal for embedded servers and high-performance compute in rugged applications and extreme environments at the edge.

Public sector: Avionics and guidance systems

  • True server-grade processing, memory, and security in soldered-down packages for rugged devices
  • Rated for continuous duty cycle under extended temperature ranges
  • Intel® AVX-512 accelerates vector processing workloads for radar and other compute-intensive workloads
  • Hard real-time capabilities1 and Intel Xeon processor-class RAS for critical workloads in avionics, flight controls, and weapons systems
  • Large core counts can run multiple identical systems for error control, redundancy, and failover support

Industrial sectors: Industrial PCs, edge servers, real-time control systems

  • Real-time capabilities and Intel Xeon processor-class RAS features can run multiple, simultaneous process and motion control systems with high reliability
  • Consolidate workloads and validate a single, software-based platform for multiple applications
  • Four up to 20 cores, AI acceleration, and up to 56 high-speed lanes deliver server-grade performance
  • Extended temperature ranges and industrial ratings in BGA packages provide rugged performance for extreme environments

Video systems: Smart video servers, including storage, analytics, and hybrid servers

  • Intel® DL Boost accelerates AI-powered object detection, image search, and smart video management
  • Intel Distribution of OpenVINO toolkit supports write-once, deploy-anywhere deep learning inference for object detection, recognition, and classification
  • High bandwidth, high-speed I/Os, larger memory bandwidth support multiple video streams, expansive storage, and fast video analytics
  • Intel® Total Memory Encryption (Intel® TME) and Intel® Software Guard Extensions (Intel® SGX) help secure servers and help protect data in memory2
  • Small form factor, soldered-down design brings high performance to demanding environments


  • Server-grade performance and I/Os in high-density BGA packages for rugged, soldered-down applications
  • Intel® 10 nm process technology
  • Intel Xeon D-1700: four to 10 cores, up to 348 GB RAM, 40W to 67W power range
  • Intel Xeon D-2700: four to 20 cores, up to 1,024 GB, 65W to 118W power range
  • Faster booting with Intel® Slim Bootloader

AI acceleration

  • Intel DL Boost (VNNI) and Intel AVX-512 boost performance for deep learning workloads
  • The Intel Distribution of OpenVINO toolkit optimizes deep learning models and creates inference engines that can run across Intel® CPUs, GPUs, and VPUs

Real-time capabilities and hypervisor support

  • Intel TCC ensures low-latency, deterministic performance for real-time applications1
  • Intel® TCC Tools provides precise system tuning for real-time applications
  • Supports ACRN hypervisor plus real-time operating systems like Yocto Linux with PREEMPT_RT patch and Wind River VxWorks
  • Time-Sensitive Networking (TSN) support provided by optional Ethernet components:
    • Intel® Ethernet Network Adapter I225 – 2.5GbE with TSN capability
    • Cyclone® V FPGA-based PCIe card with TTTech TSN Switch IP solution

Core splitting and workload consolidation

  • Intel SST2 provides precise control over per-core throughput and performance. Use it to fine-tune CPU performance for multiple concurrent workloads.
  • Intel® Resource Director Technology—including Intel® Cache Monitoring Technology (Intel® CMT), Intel® Cache Allocation Technology (Intel® CAT), and Intel® Memory Bandwidth Monitoring (Intel® MBM) technology—helps share processor resources between applications and monitor how they are used


  • Intel® Boot Guard authenticates initial BIOS code, before BIOS starts, extending the hardware root of trust
  • Intel SGX isolates applications within trusted enclaves during runtime to help protect data
  • Intel TME completely encrypts data in memory, helping to protect it from physical access

Select Enhanced for IoT SKUs offer industrial reliability and long product availability

  • Rated for continuous industrial duty cycles 24/7/365 in extended temperature ranges
  • Long product availability supports the longer lead times, extensive validation, and certification required in IoT markets
  • Intel Xeon processor-class reliability, availability, and serviceability (RAS)

High-speed I/Os

  • Up to 56 high-speed I/Os
  • Up to 32 PCIe 4.0 lanes
  • Up to 24 configurable lanes: 24x PCIe 3.0, 24x SATA 3.0, 4x USB 3.0
  • PCIe support for hot-plug swaps


  • 50Gb or 100Gb options for integrated Ethernet
  • Intel® Dynamic Device Personalization (Intel® DDP) supports programmable protocols for routing and security, reducing calls to the CPU for networking tasks

Memory and storage

  • Supports up to four channels DDR4 2933MT/s at two DIMMs per channel, max 1,024 GB memory capacity
  • Supports error correcting code (ECC) memory
  • Intel® Volume Management Device (Intel® VMD) 2.0 aggregates SSDs into a single address space
  • Intel® Virtual RAID on CPU (Intel® VROC) shifts raid controller from host bus adapter to the CPU itself

Intel® development tools

  • Intel® oneAPI Base and IoT Toolkit, Intel® oneAPI Video Processing Library
  • Intel Distribution of OpenVINO toolkit for deep learning inference
  • Intel® DevCloud for the Edge is an online sandbox running the OpenVINO toolkit in a JupyterLab environment. DevCloud includes Intel® hardware, tutorials, and sample applications.
  • Intel TCC Tools

Two server-class performance levels for IoT and edge computing

Intel Xeon D-1700 processors
Server-grade performance for small form factors

  • Options from four cores up to 10 cores
  • Up to three channels DDR4 and 384 GB memory capacity
  • Up to 16 PCIe 4.0 plus 24 high-speed I/Os
  • 40W to 67W power range
  • 50Gb and 100Gb integrated Ethernet options (100GbE enabled on select SKUs)
  • Intel SST on select SKUs
  • 45 mm x 45 mm package size

Intel Xeon D-2700 processors
High compute performance for soldered-down, edge computing applications

  • Options from four cores up to 20 cores
  • Up to four channels DDR4 and 1,024 GB memory capacity
  • Up to 32 PCIe 4.0 plus 24 high-speed I/Os
  • 50Gb and 100Gb integrated Ethernet options (100GbE enabled on select SKUs)
  • 65W to 118W power range
  • 52.5 mm x 45 mm package size