Intel® Server System S9200WK Product Family

Featuring Intel® Xeon® Platinum 9200 Processors

The Intel® Server System S9200WK product family is a purpose built, performance-optimized data center block ideal for use in high performance computing (HPC) and Artificial Intelligence(AI) applications. Designed for the 2nd Generation Intel® Xeon® Platinum 9200 processors with up to 24 DDR4 DIMM slots per compute module, the Intel® Server System S9200WK product family maximizes processor and memory bandwidth to provide leadership performance for the most demanding compute use.

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Intel® Server System S9200WK Product Family

Intel® Server System S9200WK Family

High performance computing (HPC) and Artificial Intelligence (AI) Intel® Server System S9200WK product family featuring Intel® Xeon® Platinum 9200 processors.

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Product Name
Launch Date
Status
Board Form Factor
Chasis Form Factor
Socket
Price
Intel® Server System S9232WK1HAC Compute Module Q1'20 Launched 8.33” x 21.5” 2U Rack front IO
Intel® Server System LWK2LC3U5680A Q2'19 Launched 8.33” x 21.5” 2U Rack front IO
Intel® Server System S9232WK1HLC Compute Module Q3'19 Launched 8.33” x 21.5” 2U Rack front IO
Intel® Server System S9256WK1HLC Compute Module Q3'19 Launched 8.33” x 21.5” 2U Rack front IO
Intel® Server System S9248WK1HLC Compute Module Q3'19 Launched 8.33” x 21.5” 2U Rack front IO
Intel® Server System S9248WK2HLC Compute Module Q3'19 Launched 8.33” x 21.5” 2U Rack front IO
Intel® Server System S9232WK2HLC Compute Module Q3'19 Launched 8.33” x 21.5” 2U Rack front IO
Intel® Server System S9248WK2HAC Compute Module Q3'19 Launched 8.33” x 21.5” 2U Rack front IO
Intel® Server System S9232WK2HAC Compute Module Q3'19 Launched 8.33” x 21.5” 2U Rack front IO

Key Features

Peak Performance

See maximum 2nd Generation Intel® Xeon® Platinum 9200 processors performance, with leadership CPU performance per socket thanks to Intel’s highest core count processors.

Higher Memory Bandwidth

Get double-the-memory bandwidth for memory-intensive workloads with 12 memory channels per CPU and 24 memory channels per compute module.

Better for Data Analytics

New Intel® Deep Learning Boost (Intel® DL Boost) Instructions greatly accelerates inference performance for data analytics.

Multi-Chip Advantage

Multi-Chip packaging is optimized for density and performance. 

Features of Density-Optimized 2U Rack Server with Air-Cooled and Liquid-Cooled Options

Compute Options

Up to four compute modules per 2U chassis which can support multiple compute module types in a single chassis. 2 CPU computer module design with advanced cooling technology for high flow rate air-cooled or liquid-cooling for CPUS, VRs, DIMMs, and memory VRs for high heat capture ration. Hot swappable compute modules, storage 1, fans, and power supplies.

Power Consumption

Delivers up to 350W processor TDP for high performance workloads in a 2U air-cooled chassis, up to 400W processor TDP with liquid-cooled versions

Expansion Options

Up to 2 x 16 PCIe* slots in 1U compute modules, up to 4 x 16 PCIe* slots in 2U compute modules for network expansion options.

Storage Options

Support for @x M.2 SATA/NVMe* storage device per 1U compute module, up to 2x M.2 SATA/NVMe*, and 2x U2 NVMe* storage devices per 2U compute module.