Architecture Day 2020

At Architecture Day 2020, Intel Chief Architect Raja Koduri, Intel fellows and architects provided details on the progress Intel is making on its six pillars of technology innovation: process and packaging, architecture, memory, interconnects, security and software. Intel is taking full advantage of its unique position to deliver a mix of scalar, vector, matrix and spatial architectures deployed in CPUs, GPUs, accelerators and FPGAs – unified by oneAPI, an industry-standard open programming model to simplify application development.

Intel revealed its 10nm SuperFin technology, representing the largest single intranode enhancement in the company’s history and delivering performance improvement comparable to a full-node transition. Intel also unveiled architectural details of its Willow Cove microarchitecture and the Tiger Lake system-on-chip architecture for mobile client and provided first looks at its fully scalable Xe graphics architectures. Together with Intel’s disaggregated design approach and coupled with advanced packaging technology, XPU offerings and software-centric strategy, the company is focused on developing leading products across its portfolio to customers.

Raja Koduri Editorial: Intel Delivers Advances Across 6 Pillars of Technology, Powering Our Leadership Product Roadmap

Event Fact Sheet: Intel Unpacks Architectural Innovations and Reveals New Transistor Technology

Presentation: Intel Architecture Day 2020 Presentation Slides

More Resources: Six Pillars of Technology Innovation for the Next Era of Computing

Event Video Replay


Tiger Lake Explainer

SuperFin Technology Explainer

About Intel

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