Intel is the global leader in processor innovation. Watch this video to get a step-by-step glimpse of how we create this technology.
More About Intel’s Pillars
Meet Tiger Lake, Intel’s next generation mobile client processor. It features SuperFin, a combination of new transistor technologies, as well as an improved metal stack, for increasing current, lowering voltages, and helping ensure a solid power delivery response.
Intel® Optane™ technology bridges critical capacity and performance gaps in the storage and memory hierarchy to enable a smarter architecture, so businesses can confidently accelerate transactions and time to actionable insights.
Intel delivers technologies that scale from microns to miles across all interconnect layers. Learn more by watching this virtual briefing.
Learn about Intel’s hardware-enabled security solutions, security practices, and initiatives.
At Intel, we see the future as a heterogeneous mix of scalar, vector, matrix, and spatial architectures deployed in CPU, GPU, accelerator, and FPGA sockets. oneAPI is a unified and simplified programming model for this new computing landscape, that delivers uncompromised performance on a base of industry standards and open specifications. Watch this video to learn more.
Architecture Day 2021
Intel Chief Architect Raja Koduri, Intel fellows, and architects provided details on the progress Intel is making on its six pillars of technology innovation: process and packaging, architecture, memory, interconnects, security and software.
Memory and Storage Moment 2020
At Intel’s Memory and Storage 2020 event on Dec. 16, we highlighted six new memory and storage products to help customers meet the challenges of digital transformation, 5G, network transformation, artificial intelligence and the intelligent edge.
Intel is accelerating its annual cadence of innovation with new advancements in semiconductor process and packaging under its IDM 2.0 strategy announced in March 2021. Intel CEO Pat Gelsinger and Dr. Ann Kelleher, Senior Vice President and General Manager of Technology Development, provided a deeper look at Intel’s process and packaging roadmaps.
Frequently Asked Questions
The landscape for computing has evolved dramatically over the past decade. We operate in a world where we generate data at a faster rate than our ability to analyze, understand and help secure it. We see immense demand for computing architectures that evolve rapidly and scale exponentially. And we have a bold engineering vision over the next five years to deliver 10 petaFLOPS of compute and 10 petabytes of data within 10 milliseconds to every person in the world. We believe these six technology pillars are the key enablers for us to drive the needed product innovation to achieve this.
How do Intel’s investments in the technology pillars drive Moore’s Law-like leaps forward in user experience?
In the previous generations, the answer has been that transistor density and Moore’s Law will play the lead role to solve computing problems. But as the process node transitions have slowed from the pace of the previous decades, it is the essence of Moore’s Law that continues to provide new technologies and capabilities to meet the demands of modern computing. The message of Moore’s Law is about more than transistors alone, with the combination of transistors, architectural research, connectivity advancements, faster memory systems, and software working together to drive it forward.
How do the IP and resources in the technology pillars best position Intel to deliver differentiated products?
The sheer volume and breadth of IP available is unprecedented. The scale of these resources gives Intel a differentiated set of technologies in each of these pillars to apply as we drive wave after wave of innovation for client, edge and cloud computing environments. Intel is uniquely positioned to deliver leadership across all six of these pillars, which provides a foundation for sustained innovation nobody else can offer.