Intel Custom Foundry Manufacturing Services delivers the full advantages of an IDM Foundry, offering in-house services ranging from mask generation and wafer fabrication through package, assembly, test to a range of supply chain services. While the complete offering of all needed services offers the benefits of a single supply chain solution to the customer, multiple Intel Copy Exactly! facilities around the world ensure leading edge supply availability and continuity.
Intel’s Copy Exactly! enables delivery of product from multiple production sites, which operate together as a single virtual factory. Performance is consistent and independent of the particular manufacturing site. Benefits include quicker production ramps with improved product availability and enhanced quality.
Intel is an industry leader in package and assembly technologies enabling Intel Custom Foundry to offer a wide variety of packaging solutions, meeting a diverse set of requirements from high performance to low power for various market segments. These leverage both Intel’s enormous investments in package assembly R&D as well as internal high volume product learnings about chip-package interactions and package reliability to ensure smooth production ramps.
|Service Category||Service Sub Category|
|Electrical Signal Integrity Modeling||
1. Fully validated package-level high-frequency transmission-line models provided for each critical interface
2. Package-level high-frequency S-parameter modeling and analysis performed to demonstrate that the package design meets specs / targets
|Electrical Power Delivery Modeling||
1. Power Delivery analysis performed for both AC and DC to determine optimized package design for I/O and Core power delivery, including decoupling capacitor solution and power/ground plane design
2. Lumped Package Power Delivery RLC model available to customer for system analysis
Standard: Component thermal model and analysis
Custom: Board/system level thermal model
|Package to Board Enabling||
Validated Package to Board SMT process recipe
Custom: SMT process recipe for Custom Board and/or Custom SMT material
Intel Custom Foundry offers complete test services. They include test plan definition per customer requirements, designing and developing test interface hardware, and test program development and debug services. We can also convert customer provided test patterns to those used by Intel’s world class highly parallel test platforms.
Intel Custom Foundry provides a frequent and regularly scheduled shuttle service for all technology offerings. Streamlined shuttle tape-in is provided via an efficient and secure web portal. Support staff is available on a 24/7 basis should they be needed to assist you directly in any way during the process. Delivery of fully packaged shuttle parts is reliable and predictable since even our advanced processes have been fully pipe-cleaned by our own volume manufacturing.
Intel prepares your design database for manufacturing by performing design for manufacturability (DFM) checks and corrections, using the experience we have gained manufacturing several generations of volume manufacture of tri-gate and multi-patterned devices. This work is completed using our state-of-the-art, secure data centers. Customers can conveniently validate their designs online before releasing the design database for mask generation.
We provide in-house ISO certified mask generation with competitive lead time. Our mask generation process has been co-optimized with our technology development and is also synchronized to stay ahead of the material movement in the fab.
We offer state-of-the-art wafer test solutions for a broad range of die size, pin count, and device power requirements. Data collected at E-test and Wafer Sort is used to conveniently target die for downstream package, test, and product SKU decisions. Intel Custom Foundry offers design and development of wafer sort interface hardware, wafer level test program development, and associated debug services.
Intel can develop your product qualification plan and perform all aspects of product qualification. Our Product Qualification Services encompasses support for a complete set of product and package qualification stresses such as burn-in, temperature cycling, high temperature bake, and ESD/latch-up.
Intel Custom Foundry offers characterization and debug services in our state-of-the-art labs. We perform fault isolation (FI) and failure analysis (FA) using a full suite of specialized optical and physical probe-based tools. We have extensive expertise in silicon as well as package-level failure analysis that utilizes an integrated approach for efficient problem solving. We can also collect engineering data for product characterization.
Intel has a proven low touch, customer friendly, and adaptable supply chain solution. We offer end-to-end supply chain solutions to support our foundry customers’ manufacturing requirements. These include multiple inventory locations for flexibility unit-to-wafer traceability, EDI/B2B capabilities, US and International manufacturing locations and custom shipping options.