Improve time to value with Intel Foundry Services’ (IFS) open chiplet platform on a package.
Build Better, Faster
We expect to accelerate your designs by providing services and software that leverage our vast experience in designing systems of chips, and by providing cores from Intel and the ecosystem that are optimized for Intel process technologies.
Setting the Chiplet Standard
Working together with other companies, Intel established the Universal Chiplet Interconnect Express (UCIe) standard as a high-bandwidth, low-latency connector for those computing blocks to communicate inside a chip and led the ecosystem to create the UCIe Consortium.
Leverage Our Packaging Leadership
Packaging and assembly standards for disaggregate, heterogenous design are crucial to seamlessly integrate chiplets into a package. Intel’s advanced packaging technologies such as EMIB and Foveros enable new design options that will drive the chiplet ecosystem, delivering a significant time to market advantage.
Predict, analyze, and optimize your System on a Chip (SoC) and system-level solutions using our system modeling and simulation tools such as Intel® CoFluent™ Studio, Intel® Docea™ technology, and Intel® Simics® Simulator.