Accelerate Your Chiplet Innovation
Improve time to value with Intel Foundry's open chiplet platform in a package.
Build Better, Faster
We expect to accelerate your designs by providing services and software that leverage our vast experience in designing systems of chips, and by providing cores from Intel and the ecosystem that are optimized for Intel process technologies.
Learn more about Intel Foundry Semiconductor Design Ecosystem.
Setting the Chiplet Standard
Working together with other companies, Intel established the Universal Chiplet Interconnect Express (UCIe) standard as a high-bandwidth, low-latency connector for those computing blocks to communicate inside a chip and led the ecosystem to create the UCIe Consortium.
Intel’s leadership in the development of UCIe echoes our earlier efforts driving the delivery of critical industry standards such as PCIe, SerDes, and Ethernet.
Leverage Our Packaging Leadership
Packaging and assembly standards for disaggregate, heterogenous design are crucial to seamlessly integrate chiplets into a package. Intel’s advanced packaging technologies such as EMIB and Foveros enable new design options that will drive the chiplet ecosystem, delivering a significant time to market advantage.
A Platform for Your Success
Predict, analyze, and optimize your System on a Chip (SoC) and system-level solutions using our system modeling and simulation tools such as:
Peek Inside Intel Foundry
Cutting-Edge Process Technologies for Data Center
See the technologies coming to market in 2025 with future Intel® Xeon® processors.
Solutions for AI Systems
Intel Foundry has announced a range of soft- and hard-reference AI interconnect designs to enable next-generation AI fabrics.