Thermal Design User Guide: Agilex™ 5 FPGAs and SoCs

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ID 814008
Date 9/30/2024
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Document Table of Contents
Document Table of Contents x
1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines 2. Agilex™ 5 FPGA Mechanical Construction 3. Agilex™ 5 FPGA CTM Construction 4. Power and Thermal Calculator (PTC) 5. General FPGA Thermal Design Considerations 6. Design Examples 7. Heat Sinks 8. Document Revision History for the Thermal Design User Guide: Agilex™ 5 FPGAs and SoCs A. Agilex™ 5 FPGA Product Keys and Package Drawings
1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines x
1.1. Definitions of Thermal and Power Terms Used in this Document
2. Agilex™ 5 FPGA Mechanical Construction x
2.1. Built-in Temperature Sensors
2.1. Built-in Temperature Sensors x
2.1.1. Agilex™ 5 FPGA Temperature Rating
3. Agilex™ 5 FPGA CTM Construction x
3.1. CTM File Format 3.2. Thermal Modeling with the CTM 3.3. CTM Top Temperature, TCASE Virtual Sensor 3.4. Obtaining the CTM
4. Power and Thermal Calculator (PTC) x
4.1. PTC Thermal Tab Parameters 4.2. Thermal Analysis with the PTC 4.3. PTC Thermal Tab Calculation Options 4.4. Thermal Resistances and Low Power Devices 4.5. Sensor Temperatures on the PTC Thermal Tab
5. General FPGA Thermal Design Considerations x
5.1. FPGA Power Considerations
5.1. FPGA Power Considerations x
5.1.1. FPGA Maximum Allowed Power Dissipation 5.1.2. Static, Dynamic, and Standby Power
5.1.2. Static, Dynamic, and Standby Power x
5.1.2.1. Future-Proofing an FPGA Thermal Design
6. Design Examples x
6.1. Example 1: Constant Die Power with CFD and TJ-MAX Calculation Mode 6.2. Example 2: Solution with Temperature-Dependent Power 6.3. Example 3: Known Cooling Capacity 6.4. Example 4: Heat Sink Selection
6.1. Example 1: Constant Die Power with CFD and TJ-MAX Calculation Mode x
6.1.1. CFD Results
7. Heat Sinks x
7.1. Attachment Force 7.2. Thermal Interface Material (TIM)
1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines
2. Agilex™ 5 FPGA Mechanical Construction
3. Agilex™ 5 FPGA CTM Construction
4. Power and Thermal Calculator (PTC)
5. General FPGA Thermal Design Considerations
6. Design Examples
7. Heat Sinks
8. Document Revision History for the Thermal Design User Guide: Agilex™ 5 FPGAs and SoCs
A. Agilex™ 5 FPGA Product Keys and Package Drawings

A. Agilex™ 5 FPGA Product Keys and Package Drawings

Agilex™ 5 package drawings are based on the die and package codes shown in the product key, as illustrated by the figure below.
Figure 11.  Agilex™ 5 Product Key

You can find all the available package mechanical drawings here: https://www.intel.com/content/www/us/en/products/details/fpga/agilex/5/docs.html?f:@emtcontenttype_en=%5BPackage%20Mechanical%20Drawings%5D

The table below shows a mapping from the product package code to the available package drawings at the time of publishing this document.

Table 5.  List of Package Drawings
Product Die Density, KLE Package Size Package Code Drawing Number
Agilex™ 5 E 052, 065 32x32 B32A N26883
052, 065 23x23 B23A N18821
008, 013 23x23 B23A N27560
008, 013 32x32 B32A N33286
008, 013 23x23 B23B N36049
013 16x16 M16A N32800
013 18x18 B18A N32682
Agilex™ 5 D 051, 064 32x32 B32B N36423

Figure 12. Package Mechanical Drawing for A5E 052, 065 B32A (N26883)

Figure 13. Package Mechanical Drawing for A5E 052, 065 B23A (N18821)

Figure 14. Package Mechanical Drawing for A5E 008, 013 B23A (N27560)

Figure 15. Package Mechanical Drawing for A5E 008, 013 B32A (N33286)

Figure 16. Package Mechanical Drawing for A5E 008, 013 B23B (N36049)

Figure 17. Package Mechanical Drawing for A5E 013 M16A (N32800)

Figure 18. Package Mechanical Drawing for A5E 013 B18A (N32682)

Figure 19. Package Mechanical Drawing for A5D 064 B32B (N36423)

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