Thermal Design User Guide: Agilex™ 5 FPGAs and SoCs

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ID 814008
Date 9/30/2024
Public
Document Table of Contents
Document Table of Contents x
1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines 2. Agilex™ 5 FPGA Mechanical Construction 3. Agilex™ 5 FPGA CTM Construction 4. Power and Thermal Calculator (PTC) 5. General FPGA Thermal Design Considerations 6. Design Examples 7. Heat Sinks 8. Document Revision History for the Thermal Design User Guide: Agilex™ 5 FPGAs and SoCs A. Agilex™ 5 FPGA Product Keys and Package Drawings
1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines x
1.1. Definitions of Thermal and Power Terms Used in this Document
2. Agilex™ 5 FPGA Mechanical Construction x
2.1. Built-in Temperature Sensors
2.1. Built-in Temperature Sensors x
2.1.1. Agilex™ 5 FPGA Temperature Rating
3. Agilex™ 5 FPGA CTM Construction x
3.1. CTM File Format 3.2. Thermal Modeling with the CTM 3.3. CTM Top Temperature, TCASE Virtual Sensor 3.4. Obtaining the CTM
4. Power and Thermal Calculator (PTC) x
4.1. PTC Thermal Tab Parameters 4.2. Thermal Analysis with the PTC 4.3. PTC Thermal Tab Calculation Options 4.4. Thermal Resistances and Low Power Devices 4.5. Sensor Temperatures on the PTC Thermal Tab
5. General FPGA Thermal Design Considerations x
5.1. FPGA Power Considerations
5.1. FPGA Power Considerations x
5.1.1. FPGA Maximum Allowed Power Dissipation 5.1.2. Static, Dynamic, and Standby Power
5.1.2. Static, Dynamic, and Standby Power x
5.1.2.1. Future-Proofing an FPGA Thermal Design
6. Design Examples x
6.1. Example 1: Constant Die Power with CFD and TJ-MAX Calculation Mode 6.2. Example 2: Solution with Temperature-Dependent Power 6.3. Example 3: Known Cooling Capacity 6.4. Example 4: Heat Sink Selection
6.1. Example 1: Constant Die Power with CFD and TJ-MAX Calculation Mode x
6.1.1. CFD Results
7. Heat Sinks x
7.1. Attachment Force 7.2. Thermal Interface Material (TIM)
1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines
2. Agilex™ 5 FPGA Mechanical Construction
3. Agilex™ 5 FPGA CTM Construction
4. Power and Thermal Calculator (PTC)
5. General FPGA Thermal Design Considerations
6. Design Examples
7. Heat Sinks
8. Document Revision History for the Thermal Design User Guide: Agilex™ 5 FPGAs and SoCs
A. Agilex™ 5 FPGA Product Keys and Package Drawings

6.3. Example 3: Known Cooling Capacity

In this example, the goal is to determine the viability of a known cooling solution. Such determinations are especially useful when an FPGA is already in the field, or planned for a system with a known cooling solution. In both cases, ΨCA is a known value and can be entered in the PTC when you have selected a Calculation mode of Find available thermal margin for cooling solution.

This example assumes the same FPGA as in the previous examples. It is to be used in a design where the ΨCA is 2.8⁰ C/W.

By entering the ambient temperature and the known ΨCA value into the PTC, we can calculate the die thermal and power margins relative to the TJ-MAX of 100⁰ C. The figure below shows the results on the PTC Thermal tab. We can conclude that the power consumption of this FPGA can be increased by an additional 7 watts, while remaining within the limits of this cooling solution.

Figure 9. Thermal Results

You can also use the following equation to calculate TJ once the thermal parameters are known:

TJ = TA + TDP * (ΨJC + ΨCA) 

TJ = 50 + 10 * (0.05 + 2.8) = 78.5
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