External Memory Interfaces Intel® Agilex™ FPGA IP Core Release Notes

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ID 683334
Date 5/31/2022
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1. External Memory Interfaces Intel Agilex FPGA IP Core Release Notes
1. External Memory Interfaces Intel Agilex FPGA IP Core Release Notes x
1.1. External Memory Interfaces Intel® Agilex™ FPGA IP v2.6.1 1.2. External Memory Interfaces Intel® Agilex™ FPGA IP v2.6.0 1.3. External Memory Interfaces Intel® Agilex™ FPGA IP v2.5.0 1.4. External Memory Interfaces Intel® Agilex™ FPGA IP v2.4.2 1.5. External Memory Interfaces Intel® Agilex™ FPGA IP v2.4.0 1.6. External Memory Interfaces Intel® Agilex™ FPGA IP v2.3.0 1.7. External Memory Interfaces Intel® Agilex™ FPGA IP v2.3.0 1.8. External Memory Interfaces Intel® Agilex™ FPGA IP v2.2.0 1.9. External Memory Interfaces Intel® Agilex™ FPGA IP v2.1.0 1.10. External Memory Interfaces Intel® Agilex™ FPGA IP v2.0.0
1. External Memory Interfaces Intel Agilex FPGA IP Core Release Notes

1.5. External Memory Interfaces Intel® Agilex™ FPGA IP v2.4.0

Table 25.  v2.4.0 2021.03.29
Description Impact
Verified in the Intel® Quartus® Prime software v21.1. Provides external memory interface IP for DDR4 and QDR-IV external memory for Intel® Agilex™ devices. The tables that follow summarize speed and feature support.
Table 26.  Agilex Fabric EMIF IP Speed Support Summary
      Max Rate (Mbps/MHz)   -1 -2 -3
Protocol Category Subcategory -1 -2 -3 Support Detail S C T H S C T H S C T H
DDR4 Memory Format UDIMM 3200/1600 (1DPC 1R) 2666/1333 (1DPC 1R) 2400/1200 (1DPC 1R)   X X X X X X X X
2666/1333 (1DPC 2R) 2400/1200 (1DPC 2R) 2133/1067 (1DPC 2R)   X X X 1 X X X 1
2666/1333 (2DPC 1R) 2400/1200 (2DPC 1R) 2133/1067 (2DPC 1R)   X X X 1,8 X X X 1,8
2133/1067 (2DPC 2R) 1866/933 (2DPC 2R) 1600/800 (2DPC 2R)   X X X 1,8 X X X 1,8
RDIMM 3200/1600 (1DPC 1R) 2666/1333 (1DPC 1R) 2400/1200 (1DPC 1R) non-3DS X X X X X X X X
2666/1333 (1DPC 2R) 2400/1200 (1DPC 2R) 2133/1067 (1DPC 2R) non-3DS X X X X X X X X
2666/1333 (2DPC 1R) 2400/1200 (2DPC 1R) 2133/1067 (2DPC 1R) non-3DS X X X 8 X X X 8
2133/1067 (2DPC 2R) 1866/933 (2DPC 2R) 1600/800 (2DPC 2R) non-3DS X X X 8 X X X 8
2666/1333 (1DPC 2R) 2400/1200 (1DPC 2R) 2133/1067 (1DPC 2R) 3DS 2S2R(2H) and 2S4R(4H) X X X 9 X X X 9
2133/1067 (2DPC 2R) 1866/933 (2DPC 2R) 1600/800 (2DPC 2R) 3DS 2S2R(2H) and 2S4R(4H) X X X 8 X X X 8
Component 3200/1600 (1R) 2666/1333 (1R) 2400/1200 (1R) x8, x16, x16 Twin-die, x16 DDP X X X 3 X X X 3
2666/1333 (2R) 2400/1200 (2R) 2133/1067 (2R) x8, x8 DDP, x16 X X X 4 X X X 4
3200/1600 (1R) 2666/1333 (1R) 2400/1200 (1R) Clamshell 1Rx16         X X X 8 X X X 8
2666/1333 (2R) 2400/1200 (2R) 2133/1067 (2R) Clamshell 2Rx16         X X X 8 X X X 8
LRDIMM 2666/1333 (1DPC 2R) 2666/1333 (1DPC 2R) 2400/1200 (1DPC 2R) 1D2R -non3DS         X X X 8 X X X 8
2666/1333 (1DPC 2R) 2666/1333 (1DPC 2R) 2400/1200 (1DPC 2R) 3DS 2S2R(2H) and 2S4R(4H)         X X X 2 X X X 2
2666/1333 (2DPC 2R) 2400/1200 (2DPC 2R) 2133/1067 (2DPC 2R) non-3DS         X X X 6 X X X 6
2666/1333 (1DPC 4R) 2666/1333 (1DPC 4R) 2400/1200 (1DPC 4R) non-3DS         X X X 6 X X X 6
2666/1333 (2DPC 2R) 1866/933 (2DPC 2R) 1600/800 (2DPC 2R) 3DS 2S2R(2H) and 2S4R(4H)         X X X 6 X X X 6
SODIMM 3200/1600 (1DPC 1R) 2666/1333 (1DPC 1R) 2400/1200 (1DPC 1R) x8, x16         X X X X X X X X
2666/1333 (1DPC 2R) 2400/1200 (1DPC 2R) 2133/1067 (1DPC 2R) x8 only       X X X X X X X X X
2666/1333 (2DPC 1R) 2400/1200 (2DPC 1R) 2133/1067 (2DPC 1R) x8, x16         X X X 7 X X X 7
2133/1067 (2DPC 2R) 1866/933 (2DPC 2R) 1600/800 (2DPC 2R) x8 only         X X X 7 X X X 7
QDR-IV Memory Protocol Component - x18 2133/1066 2133/1066 1866/933           X X X X X X X X
Component - x36 2133/1066 2133/1066 1866/933 no hardware support – not hardware validated         X X X 8 X X X 8
Support level key:
  • S = simulation support
  • C = compilation support
  • T = timing support
  • H = hardware support

  • X = supported feature.
  • An empty table cell indicates that the feature is not currently supported.

  • 1 = No hardware validation for x16 DRAM module UDIMM.
  • 2 = 3DS 2H is not hardware validated. 3DS 4H is hardware validated.
  • 3 = x16 twin-die and dual-die package (DDP) is not currently supported; support is planned in a future version of the Intel® Quartus® Prime software.
  • 4 = Dual-rank x8 DDP is not currently supported; support is planned in a future version of the Intel® Quartus® Prime software.
  • 5 = Clamshell dual-rank x16 is not currently supported; support is planned in a future version of the Intel® Quartus® Prime software.
  • 6 = Support is planned in a future version of the Intel® Quartus® Prime software.
  • 7 = Configuration with x8 is not hardware validated.
  • 8 = No hardware validation.
  • 9 = 3DS 4H is not hardware validated. 3DS 2H is hardware validated.
Note: Statements in this document that refer to future plans or expectations are forward-looking statements. These statements are based on current expectations and involve many risks and uncertainties that could cause actual results to differ materially from those expressed or implied in such statements. For more information on the factors that could cause actual results to differ materially, see our most recent earnings release and SEC filings at www.intc.com.
Table 27.  Agilex HPS EMIF IP Speed Support Summary
      Max Rate (Mbps/MHz)   -1 -2 -3
Protocol Category Subcategory -1 -2 -3 Support Detail S C T H S C T H S C T H
DDR4 Memory Format UDIMM 3200/1600 (1DPC 1R) 2666/1333 (1DPC 1R) 2400/1200 (1DPC 1R)     X X X   X X X
SODIMM 3200/1600 (1DPC 1R) 2666/1333 (1DPC 1R) 2400/1200 (1DPC 1R)     X X X   X X X
RDIMM 3200/1600 (1DPC 1R) 2666/1333 (1DPC 1R) 2400/1200 (1DPC 1R) non-3DS   X X X   X X X
2666/1333 (1DPC 2R) 2400/1200 (1DPC 2R) 2133/1067 (1DPC 2R) non-3DS   X X 1   X X 1
Component 3200/1600 (1DPC 1R) 2666/1333 (1DPC 1R) 2400/1200 (1DPC 1R) x8,x16,3DS, Single rank clamshell, Single rank twin-die x16   X X X   X X X
2666/1333 (1DPC 2R) 2666/1333 (1DPC 2R) 2400/1200 (1DPC 2R) x8, x16   X X 1   X X 1
Support level key:
  • S = simulation support
  • C = compilation support
  • T = timing support
  • H = hardware support

  • X = supported feature.
  • 1 = Not validated in hardware.
  • An empty table cell indicates that the feature is not currently supported.
Table 28.  Agilex EMIF IP Feature Support Summary
         
Protocol Category Subcategory Supported? S C T H
DDR4 Interface Width <=72 with DIMM X X X X X
<= 72 Component X X X X X
Controller Hard Controller X X X X X
PHY Hard PHY X X X X X
3DS 3DS X (1D2R/1D2R only) X X X X
Design example X X X X X
Rate (core) Quarter Rate X X X X X
DBI Read DBI X X X X X
Write DBI X X X X X
Mirroring Address mirroring for odd ranks for multi rank DIMM X X X X X
DM DM Pins X X X X X
Preamble Read Preamble Settings X X X X X
Write Preamble Settings X X X X X
Refresh 1 Temperature Controlled Refresh
Fine Granularity Refresh
Auto Self-refresh Method
Self-refresh
ODT 1 Input Buffer During Power-down Mode
Controller ECC (soft implementation only) X X X X X
Reordering X X X X X
Auto Power-down X X X X X
User Refresh
Auto Precharge X X X X
Command Priority
Calibration Address/Command Calibration X X X X X
Multi-rank Calibration X X X X X
Debug EMIF Toolkit X X X X
QDR-IV Memory Protocol Component X X X X X
Memory Type XP X X X X X
Interface Width 2 x18, x36 component X X X X 3
Controller Soft controller X X X X X
PHY Hard PHY X X X X X
Design Example Design Example          
Inversion Address bus          
Data bus          
Calibration Calibration X X X X X
Rate (core) Quarter rate X X X X X
Debug EMIF Toolkit supported by TG1, not TG2 X X X X
Support level key:
  • S = simulation support
  • C = compilation support
  • T = timing support
  • H = hardware support

  • X = supported feature.
  • 1 = Not hardware validated.
  • 2 = No width expansion support.
  • 3 = x36 is not hardware validated.
  • An empty table cell indicates that the feature is not currently supported.
Table 29.  Agilex EMIF HPS IP Feature Support Summary
         
Protocol Category Subcategory Supported? S C T H
DDR4 Interface Width <=72 with DIMM X   X X X
<= 72 Component X   X X X
Controller Hard Controller X   X X X
PHY Hard PHY X   X X X
Design Example Design Example          
Rate (core) Quarter Rate X   X X X
Half Rate X   X X X
DM DM Pins X   X X X
Preamble Read Preamble Settings X   X X X
Write Preamble Settings X   X X X
Refresh 1 Temperature Controlled Refresh
Fine Granularity Refresh
Auto Self-refresh Method
Self-refresh About
ODT 1 Input Buffer During Power-down Mode
Controller ECC X   X X X
Reordering X   X X X
Auto Power-down X   X X
User Refresh
Command Priority
Calibration Address/Command Calibration X   X X X
Debug EMIF Toolkit
Support level key:
  • S = simulation support
  • C = compilation support
  • T = timing support
  • H = hardware support

  • X = supported feature.
  • 1 = Not hardware validated.
  • An empty table cell indicates that the feature is not currently supported.
Table 30.  Agilex EMIF IP Debug Support Summary
Category Subcategory Supported?
Debug Support On-chip Debug On-chip Debug with Soft Nios® X
EMIF Toolkit Calibration Margin X
Rerun Calibration X
Vref Margining X
Driver Margining with TG1 X
Efficiency Monitor X
Efficiency Monitor with TG2 X
ODT Calibration X
Multi-interface Support X
Traffic Generator 2.0 (TG2) Configurable address pattern X
Configurable data pattern X
Configurable command pattern / test duration X
GUI to configure TG2 X
Default mode (old behavior) X
  • X = supported feature.
  • An empty table cell indicates that the feature is not currently supported.
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