AN752: Guidelines for Handling Altera Wafer Level Chip Scale Package (WLCSP)

Download PDF
ID 683229
Date 11/02/2015
Public
Document Table of Contents
Document Table of Contents x
1. Guidelines for Handling Altera Wafer Level Chip Scale Package 2. Document Revision History
1. Guidelines for Handling Altera Wafer Level Chip Scale Package x
1.1. Pick and Place Process 1.2. Vacuum Pen
1. Guidelines for Handling Altera Wafer Level Chip Scale Package
2. Document Revision History

1.1. Pick and Place Process

When picking up the component from the Tape and Reel carrier, Altera recommends that you place the pick-up tool at a vertical-height distance from the WLCSP.
  • Use vacuum pressure at approximately 60–70 kPa to lift the WLCSP from the pocket of the tape. This practice prevents direct contact on the WLCSP during pick-up.
  • Set vertical-height distance between the WLCSP and the pick-up tool to zero (minimal gap).
  • The vacuum lifts the package out from the pocket of the tape.
  • Similarly, set vertical-height distance during placement on the board to zero to avoid overdrive beyond the limit of PCB.
Figure 1. Zero Vertical-Height Distance between WLCSP and Pick-Up Tool
Figure 2. Zero Vertical-Height Distance During Board Placement
Level Two Title