The Automotive-Grade Device Handbook

ID 683121
Date 5/27/2022
Public
Document Table of Contents

2.3.2. Package Options and Maximum User I/Os

Table 8.  Package Options and Maximum User I/Os in Cyclone® V SE Devices
Package Type/ Pin Count Ball Spacing (mm) Dimensions (mm) Product Line
5CSEA2 5CSEA4 5CSEA5 5CSEA6
(25K LEs) (40K LEs) (85K LEs) (110K LEs)
FPGA I/Os / HPS I/Os
UBGA-484 0.8 19 x 19 66 / 151 66 / 151 66 / 151 66 / 151
UBGA-672 0.8 23 x 23 145 / 181 145 / 181 145 / 181 145 / 181
FBGA-896 1 31 x 31 288 / 181 288 / 181
Table 9.  Package Options and Maximum User I/Os in Cyclone® V SX Devices
Package Type/ Pin Count Ball Spacing (mm) Dimensions (mm) Product Line
5CSXC2 5CSXC4 5CSXC5 5CSXC6
(25K LEs) (40K LEs) (85K LEs) (110K LEs)
FPGA I/Os / HPS I/Os / XCVRs
UBGA-672 0.8 23 x 23 145 / 181 / 6 145 / 181 / 6 145 / 181 / 6 145 / 181 / 6
FBGA-896 1 31 x 31 288 / 181 / 9