1.2. Power Estimation with Resource Utilization
- Device—SG280 with F43 package
- Device type—X
- Junction Temperature—100°C
Resource Configuration | Static Power 1 | Dynamic Power | |
---|---|---|---|
Low utilization ~ 50% 800K half-ALMs |
High utilization ~ 90% 1.7M half-ALMs |
||
Low speed configuration:
|
NA | 18 W | 40 W |
High speed configuration:
|
NA | 27 W | 56 W |
Resource Configuration | Static Power | Dynamic Power | |
---|---|---|---|
Low utilization ~ 40% 4600 memory blocks |
High utilization ~ 70% 8500 memory blocks |
||
Low speed configuration:
|
2 W | 3.7 W | 7 W |
High speed configuration:
|
2 W | 16.5 W | 30 W |
Resource Configuration | Static Power | Dynamic Power | |
---|---|---|---|
Low utilization ~ 40% 2300 DSP blocks |
High utilization ~ 70% 4000 DSP blocks |
||
Low speed configuration:
|
2.5/4 W | 5 W | 8.6 W |
High speed configuration:
|
2.5/4 W | 40 W | 66 W |
Resource Configuration | Static Power | Dynamic Power | |
---|---|---|---|
Low utilization 16 channels |
High utilization 96 channels |
||
Low speed configuration:
|
2 W | 5 W | 40 W |
High speed configuration:
|
2 W | 7 W | 45 W |
Resource Configuration | Static Power | Dynamic Power | |
---|---|---|---|
Low utilization ~ 50% | High utilization ~ 90% | ||
Low speed configuration:
|
1 W | 3 W | 6 W |
High speed configuration:
|
1 W | 7 W | 13.5 W |
Stratix® 10 devices are significantly bigger and faster in terms of density and performance than previous generations of FPGA devices. Correspondingly, there is a increase in power consumption even with the increase in power efficiency. Therefore, you should leverage the power reduction capabilities discussed in this application note and ensure that you plan for the thermal implications of the power consumption in your Stratix® 10 FPGA designs. For more information on thermal solutions for the Stratix® 10 device designs, consult your Intel support team.