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Description
This document provides electrical, mechanical, and thermal specifications for the Intel® Pentium® M processor. Key features include:
• Supports Intel® Architecture with Dynamic Execution
• High performance, low-power core
• On-die, primary 32-kB instruction cache and 32-kB write-back data cache
• On-die, 1-MB second level cache with Advanced Transfer Cache Architecture
• Advanced Branch Prediction and Data Prefetch Logic
• Streaming SIMD Extensions 2 (SSE2) enable break-through levels of performance in multimedia applications including 3D graphics, video decoding/encoding, and speech recognition.
• 400-MHz, Source-Synchronous processor system bus to improve performance by transferring data four times per bus clock (4X data transfer rate, as in AGP 4X).
• Advanced Power Management features including Enhanced Intel SpeedStep® technology
• Micro-FCPGA and Micro-FCBGA packaging technologies
• Manufactured on Intel’s advanced 0.13 micron process technology with copper interconnect.
• Support for MMX™ technology
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