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Description
Intel Agilex® 7 F-Series Device - Package Ball Coordinates are spreadsheet documents that provide the X and Y location of the balls for the stated package and are used to generate tool-specific PCB Footprints. For:
- AGFA019R25A, AGFB019R25A, AGFC019R25A, AGFD019R25A,
- AGFA022R25A, AGFB022R25A,
- AGFA023R25A, AGFB023R25A, AGFC023R25A, AGFD023R25A,
- AGFA027R25A, AGFB027R25A