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  • Brand Name: Core i7

  • Product Number: i7-12700KF

  • Ordering Code: CM8071504553829

  • SPEC Code: SRL4P

  • Code Name: Alder Lake

Intel® Ethernet Switch FM6324

Specifications

Export specifications

Essentials

Supplemental Information

  • Description A 24 10G ports or 6 40G ports, fully-integrated, single-chip wire-speed, layer-2/3/4 Ethernet switch.

Networking Specifications

  • Maximum Port Bandwidth 240 G
  • Maximum SGMII Ports 72
  • Maximum XAUI Ports 24
  • Maximum 10G KR Ports 24
  • Maximum 40G KR4 Ports 6
  • Cut-Through Latency 400 ns
  • Frame Processing Rate 360 M pps
  • Shared Packet Memory Size 8 MB
  • Traffic Classes 8
  • MAC Table Size 64 K
  • ACL Rules 24 K
  • IPv4/IPv6 Routes 64K/16K
  • Intel® FlexPipe™ Technology Yes
  • Advanced Load Balancing Yes
  • CEE/DCB Features Yes
  • Server Virtualization Support Yes
  • Advanced Tunneling Features No
  • Carrier Ethernet Support No
  • CPU Interface PCIe, EBI
  • Applications Data Center,FSI,HPC

Package Specifications

  • Extended Temperature Options No
  • Package Size 42.5mm x 42.5mm

Ordering and Compliance

Retired and discontinued

Intel® Ethernet Switch FM6324

  • MM# 920038
  • Spec Code SLJMF
  • Ordering Code EZFM6324
  • Stepping A0
  • MDDS Content IDs 707043, 707327

Intel® Ethernet Switch FM6324

  • MM# 920039
  • Spec Code SLJMG
  • Ordering Code EZFM6324
  • Stepping A0
  • MDDS Content IDs 707043, 707327

Intel® Ethernet Switch FM6324

  • MM# 930406
  • Spec Code SLKA5
  • Ordering Code EZFM6324A
  • Stepping B2
  • MDDS Content IDs 707043, 707327

Trade compliance information

  • ECCN 5A991
  • CCATS NA
  • US HTS 8542390001

PCN Information

SLKA5

SLJMG

SLJMF

Drivers and Software

Latest Drivers & Software

Downloads Available:
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Name

Administrative Tools for Intel® Network Adapters

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Adapter User Guide for Intel® Ethernet Adapters

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Support

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.