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As computing and communications converge, innovations in micro-electronic packaging are essential to bring new products to market. Assembly and Test
Technology Development continues to build and enhance the skills of our engineering team to drive advances in electronic packaging and manufacturing.
If you want to be a part of a group working on the leading edge of silicon technology, learn about our team and submit your resume.
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| Shape the Future of Packaging Technology |
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Moore’s law and the diversity of market segments, such as personal media players, laptops and servers, has
driven packaging from a simple protective enclosure to a key enabler of product performance and market differentiation. Packaging technology will continue
to require significant advances in the areas of mechanical integrity, signal integrity, power delivery and power dissipation, and manufacturing process
technology to keep pace. As part of Intel's Assembly and Test Technology Development (ATTD) organization, you'll accelerate the development of breakthrough
packaging, motherboard, and test technologies to support Intel’s most advanced microprocessor and chipset products. Intel's wide range of laboratory environments
and development facilities allow you to research material and manufacturing technologies and transfer them into high volume manufacturing.
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To be considered for a position, please review the following descriptions of current and recurring job profiles. Please note that ATTD will only consider PhD candidates for full-time opportunities and will consider all degree levels for internship opportunities.
Selecting a job profile link below for either a full-time or internship opportunity will take you to our job search page. From the Job List, select the ATTD Virtual Career Fair Prescreen and then Apply for Job. You will be asked to create or to log in to your candidate profile, upload your resume/C.V., and complete the brief prescreening questionnaire. This will take approximately five to 10 minutes.
- Design Packaging Engineer
Qualified candidates will have obtained a PhD degree in mechanical engineering, electrical engineering, material science or physics within the last 18 months at time of hire. Ideal applicants should have research experience, published works and/or authored related presentations. Applicants should have an understanding of one or more of the following areas: physical design, reliability, thermal, electrical, material or mechanical aspects of semiconductor packages.
- Materials Packaging Engineer
Qualified candidates will have obtained a PhD degree in mechanical engineering, chemical engineering, material science (metallurgy and polymers), chemistry or physics within the last 18 months at time of hire. Ideal applicants should understand reliability, thermal, material and mechanical aspects of semiconductor packages. Additionally, applicants should have research experience, published works and/or authored related presentations.
- Process Engineer
Qualified candidates will have obtained a PhD degree in electrical engineering, mechanical engineering, chemical engineering, or material science within the last 18 months at time of hire. As a process engineer with Intel, you can focus on product test or packaging assembly processes. Scope for test process engineers includes developing and deploying processes and equipment for sort, component test, burn in or platform process validation (PPV) modules for Intel's next generation microprocessors and chipsets. Scope for packaging process engineers includes how to characterize and develop semiconductor packaging and test manufacturing processes through experimentation, co-development of materials and selection of equipment.
- Manufacturing Engineer
Qualified candidates must be currently enrolled in a Bachelors or Masters program in Industrial, Mechanical, or Computer Science. As a manufacturing engineer, you will be supporting Intel's assembly or test development factory. You will lead cross functional teams to design, develop and integrate automation systems to improve productivity, manufacturability, predictability and error free assembly and test processing. You will work with ATTD Automation and Controls peers to establish data availability models and data warehouses, conduct data analysis, develop and/or implement web portals for Factory Controls, and drive key solutions to manufacturing readiness problems in the factory and the supply chain.
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