Visible to Intel only — GUID: gwl1572012256504
Ixiasoft
Visible to Intel only — GUID: gwl1572012256504
Ixiasoft
6.5.5.3. Two DIMMs per Channel (2DPC) for SODIMM Topology
For DDR4 two DIMM per channel (2DPC) designs, Intel® recommends placing the two DIMM connectors for a channel on both the top and bottom sides of the board, for best performance.
![](/content/dam/docs/us/en/683216/23-2-2-7-1/pkr1572013018024.png)
![](/content/dam/docs/us/en/683216/23-2-2-7-1/udm1572013100777.png)
(In the above figure, CLK, CTRL refers to the per-DIMM signals (mem_ck, mem_cke, mem_odt) and remain as point-to-point connections.)
The following table provides specific routing guidelines for two DIMMs per channel in SODIMM topologies for all supported signals in the interface.
Signal Group | Segment | Routing Layer | Max Length (mil) | Target Zse (ohms) | Trace Width,W (mil) | Trace Spacing, S1 (mil): Within Group | Trace Spacing, S2 (mil): CMD/CTRL/CLK to DQ/DQS | Trace Spacing, S3 (mil): DQ Nibble to Nibble | Trace Spacing (mil), Within DIFF Pair | Trace Spacing (mil), DQS pair to DQ | Trace Spacing (mil), CLK pair to CMD/CTRL/CKE | Channel to Channel spacing (DQ to DQ between two channels) | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Segment | Total MB | ||||||||||||
CLK | BO1 | US | 50 | 5000 | 4 | 5, 17 | 5, 17 | 4 | 17 | ||||
BO2 | SL | 1000 | 4 | 5, 17 | 5, 17 | 4 | 17 | ||||||
M | SL | 45 | 4.5 | 12 (3h) | 4 | 12 (3h) | |||||||
BI | US | 300 | 4 | 12, (3h) | 4 | 12 (3h) | |||||||
CMD, ALERT | BO1 | US | 50 | 5000 | 4 | 5, 17 | 5, 17 | ||||||
BO2 | SL | 1000 | 4 | 5, 17 | 5, 17 | ||||||||
M | SL | 40 | 5.5 | 8 (2h) | 12 (3h) | ||||||||
BI | US | 300 | 4 | 8 (2h) | 12, (3h) | ||||||||
CTRL | BO1 | US | 50 | 5000 | 4 | 5, 17 | 5, 17 | ||||||
BO2 | SL | 1000 | 4 | 5, 17 | 5, 17 | ||||||||
M | SL | 45 | 4.5 | 8 (2h) | 12 (3h) | ||||||||
BI | US | 300 | 4 | 12, (3h) | |||||||||
DQ | BO1 | US | 50 | 5000 | 3 | 5, 17 | 17 | 17 | |||||
BO2 | SL | 1000 | 3 | 5, 17 | 17 | 17 | |||||||
M | SL | 40 | 5.5 | 8 (2h) | 12 (3h) | 16 (4h) | |||||||
BI | US | 300 | 4 | 8 (2h) | 12 (3h) | 16 (4h) | |||||||
DQS | BO1 | US | 50 | 5000 | 3 | 5, 17 | 4 | 17 | |||||
BO2 | SL | 1000 | 3 | 5, 17 | 4 | 17 | |||||||
M | SL | 40 | 5.5 | 4 | 12 (3h) | ||||||||
BI | US | 300 | 4 | ||||||||||
For an explanation of the guidelines represented in this table, refer to the bullet points immediately following Figure 134. |
The following figure shows the RESET signal scheme and routing guideline for two DIMMs per channel topologies.
![](/content/dam/docs/us/en/683216/23-2-2-7-1/zry1571940985811.png)
The target impedance for RESET signal is 50 ohms. The RESET signal shall have at least 3×h (where h stands for trace to nearest reference plane height or distance) spacing to other nearby signals on the same layer. The end-to-end RESET trace length is not limited but shall not exceed 5 inches.