Note: For device drying or baking conditions, please refer to the higher temperature (125C +/10C, <5% RH) User Bake conditions stipulated in J-STD-033 Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices.
A RoHS-compliant part number is denoted by the suffix "N".
Moisture/Reflow Sensitivity Classification
If a device is classified as MSL 1, it is not moisture sensitive and the device does not have to be dry packed again after the pack has been opened.
If a device is classified at a higher numerical level, it is moisture sensitive and must be dry packed in accordance with J-STD-033.
If a device is classified as Level 6, it is extremely moisture sensitive and the dry pack will not provide adequate protection. Please refer to Intel® packing label on the baking time before reflow soldering.