Socket Package Carrier for 4th and 5th Generation Intel® Xeon® Scalable Processors





This article lists the types of Socket E1 (LGA4677-1) Package Carries for 4th Generation Intel® Xeon® Scalable Processors.

    For a complete list of compatible Xeon Sockets, please check Sockets Supported by Intel® Xeon® Processors.

    Note The information in this article is only applicable to 4th Generation Intel® Xeon® Scalable Processors.

    Sapphire Rapids


    Sapphire Rapids server/workstation SKUs use Socket E1 (LGA4677-1) and the enabled loading mechanism requires a Package Carrier. 
    There are three carrier types for the different package types:  E1A, E1B, & E1C.

    Types of Carries

    Types of Carries

    Package Carrier features include:

    • Enabling removal of the CPU without separating the CPU TIM (thermal interface material) bond.
    • Visual markings indicating the proper carrier-to-CPU pairing.
    • Physical keying features that mitigate the mixing of:
      • A carrier to the wrong CPU SKU.
      • A CPU to the wrong socket/platform type.
    • Integrated TIM breaker features for separating the CPU from the heatsink when needed.
    • Shim features on  E1B carriers that adapt the bolster plate load to the slightly taller package height of some CPU SKUs.
    • Refinements to the E1C carrier that accommodate the larger packages with HBM. 

    Package Carrier Features – TIM Bond Breaker & Shims

    Separation of the TIM bond:

    E1A & E1B – Integrated TIM Break Lever

    E1C – Integrated TIM Break Cam 
    Cam rotated by a  ¼” flathead screwdriver

    Shim features on E1B carriers ensure proper bolster plate loading on non-HBM CPU SKUs that use the E1A carrier.

    TIM Bond Breaker & Shims

    A complete list of Package Carrier types for each SKU may be found in the Package Specifications section for the CPU on