Processor Support for Intel® Server Board D40AMP


Install & Setup



The Intel® Server Board D40AMP includes two Socket-P4 LGA4189 processor sockets compatible with the 3rd Generation Intel® Xeon® Scalable Processor family.

Note Previous-generation Intel® Xeon® Processors and Intel® Xeon® Scalable Processor families and their supported processor heat sinks are not compatible with Intel® Server Boards described in this document.

Processor Heat Sink Module (PHM) assembly and Processor Socket assembly

This generation of server system requires that the processor be pre-assembled to the heat sink before installation onto the Intel® Server Board.

The processor heat sink assembly is commonly referred to as the Processor Heat Sink Module or PHM. The assembly is installed onto the processor socket assembly (referred to as the loading mechanism) on the Intel Server Board.

Note The following figure identifies the Processor Heat Sink Module (PHM) components, not the processor installation process.


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Note For detailed processor assembly and installation instructions, see the Integration and Service Guide for Intel® Server System D40AMP Product Family.


Processor heat sink 

Intel® Server Board D40AMP family supports 1U height heat sinks as shown in the following figures. 

As the following figures show, there are two types of 2U heat sinks and three types of 1U heat sinks:

  • Front heat sink
  • Back heat sink

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The front heat sink type is used for CPU 0, and the back heat sink type is used for CPU 1. The exploded views in the figures show the difference. The back heat sink types have more heat venting fins.

Note Heat sinks are not interchangeable. The descriptions above must be followed.

The following figure shows a module with 1U front and back heat sinks installed. Only 1U standard front heat sink and 1U back heat sink are shown.

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Processor Thermal Design Power (TDP) support

To allow optimal operation and long-term reliability of Intel® Server System D40AMP-based systems, the processor must remain within the defined minimum and maximum case temperature (TCASE) specifications.

When installed in an Intel® D40AMP module, the Intel® Server Board D40AMP family supports a maximum processor TDP up to and including 205 W. Depending on the system module and configuration, the Intel® Server System D40AMP may support a TDP up to and including 205 W. For details, see Appendix E of the Technical Product Specification for the Intel® Server System D40AMP Product Family.

Processor family overview

The Intel® Server Board D40AMP family supports the 3rd Generation Intel® Xeon® Scalable Processor family. Processor shelves within the product family are identified as shown in the following figure.

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Note Supported 3rd Generation Intel® Xeon® Scalable Processor SKUs must not end in (H), (L), or (U). All other processor SKUs are supported.
Note The 8351N SKU is a 1-socket optimized SKU and is not supported on the Intel® Server Board D40AMP Product Family.


Feature Platinum 8300 Processors Gold 6300 Processors Gold 5300 Processors Silver 4300 Processor
# of Intel® Ultra Path Interconnect (Intel® UPI) Links 3 3 3 2
Intel® UPI Speed 11.2 GT/s 11.2 GT/s 11.2 GT/s 10.4 GT/s
Supported Topologies 2S-2UPI
Node Controller Support No No No No
Processor RAS Capability Advanced Advanced Advanced Standard
# of DDR4 Integrated Memory Controllers (IMC) 4 4 4 4
# DDR4 Channels 8 8 8 8
Intel® Turbo Boost Technology Yes Yes Yes Yes
Intel® Hyper-Threading Technology (Intel® HT Technology) Yes Yes Yes Yes
Intel® Advanced Vector Extensions 512 (Intel® AVX-512) ISA Support Yes Yes Yes Yes
Intel® AVX-512 - # of 512b FMA Units 2 2 2.0 2
# of PCIe* Lanes 64 64 64 64
Intel® Volume Management Device (Intel® VMD) 2.0 Yes Yes Yes Yes

Feature may vary between processor SKUs.

Refer to 3rd Generation Intel® Xeon® Scalable Processor specification sheets and product briefs for additional information.