Summary
Explains the hole is called the “vent hole” for heat dissipation and alignment.
Description
Will there be an issue if the thermal grease/paste (Thermal Interface Materials) gets into the small hole?
Resolution
The hole is called “vent hole” for heat dissipation and alignment. The IHS is glued to the processor substrate with epoxy at the Intel plant. The hole allows gases and pressure to escape while the epoxy cures. Without the hole the pressure would deform the epoxy bond and make the connection between substrate and IHS uneven.
It is perfectly safe to cover and/or fill it with thermal paste.