Industry Specifications for Intel® NUC


Product Information & Documentation



Intel® NUC Boards and Kits are designed to comply with the industry specifications listed in the table. See your technical product specification or product guide to get the specific features offered with your board.

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Reference Name Specification Title Version, Revision Date, and Ownership
ACPI Advanced Configuration and Power Interface Specification Version 2.0a, March 31, 2002, Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, Phoenix Technologies Limited, and Toshiba Corporation
BIOS Protection Guidelines BIOS Protection Guidelines—Recommendations of the National Institute of Standards and Technology (PDF)PDF icon NIST Special Publication 800-147, April 2011, National Institute of Standards and Technology
Bluetooth® Bluetooth® Core Specification Core specification version 5.0, Specification supplement 7 and Addendum 6
Chassis Design Thermally Advantaged Small Chassis (TASC) Design Guide 1.0 or later
Double Data Rate (DDR3) SDRAM Specification JEDEC* Solid-State Technology Association
Embedded DisplayPort (eDP) VESA Embedded DisplayPort (eDP) Standard  
EFI BIOS Extensible Firmware Interface TianoCore Organization
ENERGY STAR® ENERGY STAR® Program Requirements for Computers  
Fans 4-Wire Pulse Width Modulation (PWM) Controlled Fans Specification (PDF)PDF icon Revision 1.3, September 2005, Intel Corporation
HDCP HDCP Specifications  
HDMI*/CEC HDMI Specification 1.4b  
HDMI/CEC HDMI Specification 2.1  
LPC Low Pin Count Interface Specification Revision 1.0, September 29, 1997, Intel Corporation
NVMe Non-Volatile Memory Express Revision 1.3, April 2017
PCI Express* Mini-card PCI Express Base Specification 2.0
PCI Express Mini-card PCI Express Mini Card Electromechanical Specification 2.0
SD Card SDXC v3.01 with UHS-I support  
Serial ATA (SATA/eSATA/mSATA) Serial ATA Revision 2.6 Specification Revision 2.6, April 8, 2009, Serial ATA International Organization
SMBIOS System Management BIOS Version 2.3.4, January 20, 2003, American Megatrends Incorporated, Award Software International Incorporated, Compaq Computer Corporation, Dell Computer Corporation, Hewlett-Packard Company, Intel Corporation, International Business Machines Corporation, Phoenix Technologies Limited, and SystemSoft Corporation
SO-DIMM Double Data Rate (DDR2) SDRAM SO-DIMM Specification JEDEC Solid-State Technology Association
TPM Trusted Computing Group Specification Version 1.2, August 2008, Trusted Computing Group
Type C/Thunderbolt™ Thunderbolt Intel Corporation and Apple Incorporated
UEFI BIOS Unified Extensible Firmware Interface Specification Version 2.0, January 31, 2006, Unified Extensible Firmware Interface, Inc.
USB Universal Serial Bus Specification Revision 2.0, April 27, 2000, Compaq Computer Corporation, Hewlett-Packard Company, Lucent Technologies Inc., Intel Corporation, Microsoft Corporation, NEC Corporation, and Koninklijke Philips Electronics N.V.
VESA standard mounting Flat Display Mounting Interface Standard (FDMI) (PDF)PDF icon Ver. 1 Rev 1, January 2006
Wi-Fi IEEE* 802.11: Wireless Local Area Networks (LANs)  
Note PDF files require Adobe Acrobat Reader*.