Industry Specifications for Intel® NUC
Intel® NUC Boards and Kits are designed to comply with the industry specifications listed in the table. See your technical product specification or product guide to get the specific features offered with your board.
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| Reference Name | Specification Title | Version, Revision Date, and Ownership |
| ACPI | Advanced Configuration and Power Interface Specification | Version 2.0a, March 31, 2002, Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, Phoenix Technologies Limited, and Toshiba Corporation |
| BIOS Protection Guidelines | BIOS Protection Guidelines—Recommendations of the National Institute of Standards and Technology (PDF) | NIST Special Publication 800-147, April 2011, National Institute of Standards and Technology |
| Bluetooth® | Bluetooth® Core Specification | Core specification version 5.0, Specification supplement 7 and Addendum 6 |
| Chassis Design | Thermally Advantaged Small Chassis (TASC) Design Guide | 1.0 or later |
| DDR3 SDRAM DDR4 SDRAM | Double Data Rate (DDR3) SDRAM Specification | JEDEC* Solid-State Technology Association |
| Embedded DisplayPort (eDP) | VESA Embedded DisplayPort (eDP) Standard | |
| EFI BIOS | Extensible Firmware Interface | TianoCore Organization |
| ENERGY STAR® | ENERGY STAR® Program Requirements for Computers | |
| Fans | 4-Wire Pulse Width Modulation (PWM) Controlled Fans Specification (PDF) | Revision 1.3, September 2005, Intel Corporation |
| HDCP | HDCP Specifications | |
| HDMI*/CEC | HDMI Specification 1.4b | |
| HDMI/CEC | HDMI Specification 2.1 | |
| LPC | Low Pin Count Interface Specification | Revision 1.0, September 29, 1997, Intel Corporation |
| NVMe | Non-Volatile Memory Express | Revision 1.3, April 2017 |
| PCI Express* Mini-card | PCI Express Base Specification | 2.0 |
| PCI Express Mini-card | PCI Express Mini Card Electromechanical Specification | 2.0 |
| SD Card | SDXC v3.01 with UHS-I support | |
| Serial ATA (SATA/eSATA/mSATA) | Serial ATA Revision 2.6 Specification | Revision 2.6, April 8, 2009, Serial ATA International Organization |
| SMBIOS | System Management BIOS | Version 2.3.4, January 20, 2003, American Megatrends Incorporated, Award Software International Incorporated, Compaq Computer Corporation, Dell Computer Corporation, Hewlett-Packard Company, Intel Corporation, International Business Machines Corporation, Phoenix Technologies Limited, and SystemSoft Corporation |
| SO-DIMM | Double Data Rate (DDR2) SDRAM SO-DIMM Specification | JEDEC Solid-State Technology Association |
| TPM | Trusted Computing Group Specification | Version 1.2, August 2008, Trusted Computing Group |
| Type C/Thunderbolt™ | Thunderbolt | Intel Corporation and Apple Incorporated |
| UEFI BIOS | Unified Extensible Firmware Interface Specification | Version 2.0, January 31, 2006, Unified Extensible Firmware Interface, Inc. |
| USB | Universal Serial Bus Specification | Revision 2.0, April 27, 2000, Compaq Computer Corporation, Hewlett-Packard Company, Lucent Technologies Inc., Intel Corporation, Microsoft Corporation, NEC Corporation, and Koninklijke Philips Electronics N.V. |
| VESA standard mounting | Flat Display Mounting Interface Standard (FDMI) (PDF) | Ver. 1 Rev 1, January 2006 |
| Wi-Fi | IEEE* 802.11: Wireless Local Area Networks (LANs) |
| Note | PDF files require Adobe Acrobat Reader*. |