This document describes the various desktop processor package types.
FC-LGAx package type
The FC-LGAx package is the latest package type used with the current family of desktop processors going back to the Intel® Pentium® 4 processors designed for the LGA775 socket and extending to the Intel® Core™i7-2xxx series processors designed for the LGA1155 socket. FC-LGA is short for Flip Chip Land Grid Array x. FC (Flip Chip) means that the processor die is on top of the substrate on the opposite side from the LAND contacts. LGA (LAND Grid Array) refers to how the processor die is attached to the substrate. The number x stands for the revision number of the package.
This package consists of a processor core mounted on a substrate land-carrier. An integrated Heat Spreader (IHS) is attached to the package substrate and core and serves as the mating surface for the processor component thermal solution such as a heatsink. You may also see references to processors in the 775-LAND or LAG775 package. This refers to the number of contacts that the package contains that interface with the LGA775 socket.
Current socket types that are used with the FC-LGAx Package types are LGA775, LGA1366 and LGA1156. Sockets are not interchangeable and must be matched to motherboards for compatibility. (Motherboard BIOS support for processors is also required for compatibility.)
|Looking for mobile processor package types?|
|Guide to Intel® desktop boxed processors and sockets|
LGA775 socket (2004) - Installation and integration information
The pictures below may include the LAND Side Cover (LSC). This black cover is no longer being used.
(Front side) (Back side)
LGA1156 socket (2009) - Installation and integration information
LGA1155 socket (2011) - Installation and integration information
LGA1150 socket (2013) - Installation and integration information
FC-PGA2 package type
FC-PGA2 packages are similar to the FC-PGA package type, except these processors also have an Integrated Heat Sink (IHS). The integrated heat sink is attached directly to the die of the processor during manufacturing. Since the IHS makes a good thermal contact with the die and it offers a larger surface area for better heat dissipation, it can significantly increase thermal conductivity. The FC-PGA2 package is used in Pentium III and Intel Celeron processor (370 pins) and the Pentium 4 processor (478 pins).
FC-PGA package type
The FC-PGA package is short for flip chip pin grid array, which have pins that are inserted into a socket. These chips are turned upside down so that the die or the part of the processor that makes up the computer chip is exposed on the top of the processor. By having the die exposed allows the thermal solution can be applied directly to the die, which allows for more efficient cooling of the chip. To enhance the performance of the package by decoupling the power and ground signals, FC-PGA processors have discrete capacitors and resistors on the bottom of the processor, in the capacitor placement area (center of processor). The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The FC-PGA package is used in Pentium® III and Intel® Celeron® processors, which use 370 pins.
OOI package type
OOI is short for OLGA. OLGA stands for Organic Land Grid Array. The OLGA chips also use a flip chip design, where the processor is attached to the substrate facedown for better signal integrity, more efficient heat removal and lower inductance. The OOI then has an Integrated Heat Spreader (IHS) that helps heatsink dissipation to a properly attached fan heatsink. The OOI is used by the Pentium 4 processor, which has 423 pins.
PGA package type
PGA is short for Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PGA package is used by the Intel Xeon® processor, which has 603 pins.
PPGA package type
PPGA is short for Plastic Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PPGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PPGA package is used by early Intel Celeron processors, which have 370 pins.
S.E.C.C. package type
S.E.C.C. is short for Single Edge Contact Cartridge. To connect to the motherboard, the processor is inserted into a slot. Instead of having pins, it uses gold finger contacts, which the processor uses to carry its signals back and forth. The S.E.C.C. is covered with a metal shell that covers the top of the entire cartridge assembly. The back of the cartridge is a thermal plate that acts as a heatsink. Inside the S.E.C.C., most processors have a printed circuit board called the substrate that links together the processor, the L2 cache and the bus termination circuits. The S.E.C.C. package was used in the Intel Pentium II processors, which have 242 contacts and the Pentium® II Xeon® and Pentium III Xeon processors, which have 330 contacts.
S.E.C.C.2 package type
The S.E.C.C.2 package is similar to the S.E.C.C. package except the S.E.C.C.2 uses less casing and does not include the thermal plate. The S.E.C.C.2 package was used in some later versions of the Pentium II processor and Pentium III processor (242 contacts).
S.E.P. package type
S.E.P. is short for Single Edge Processor. The S.E.P. package is similar to an S.E.C.C. or S.E.C.C.2 package but it has no covering. In addition, the substrate (circuit board) is visible from the bottom side. The S.E.P. package was used by early Intel Celeron processors, which have 242 contacts.