Intel Presents 10 Quantum Computing Papers at APS March Meeting 2021

Otto Zietz, an Intel research engineer, stands with the quantum cryoprober at Intel’s Jones Farm Campus in Hillsboro, Oregon. The tool can chill a 300-millimeter silicon wafer to almost absolute zero, a temperature low enough for quantum computing research. With its capacity to work with large wafers, Intel’s cryoprober is the only tool of its kind in the world. (Credit: Walden Kirsch/Intel Corporation)

Intel researchers and collaborators will present 10 papers at the virtual American Physical Society (APS) March Meeting 2021 on March 15-19. Through its annual March Meeting, APS works to advance scientific discovery and research dissemination. Intel researchers will present papers on high volume manufacturing of silicon spin qubits and the first test results from the cryoprober measurement tool for qubit chips, as well as research on quantum computation and algorithms.

At APS, Intel will show results of the cryoprober measurement tool for the first time. The cryoprober streamlines testing and verification of qubits, which is an essential milestone on the path to high volume manufacturing. Built by Intel, Bluefors, and Afore, the Cryogenic Wafer Prober tests and validates qubits on 300mm wafers down to temperatures of a few kelvins, making it a first-of-its-kind testing tool for qubit chips. The tool allows Intel to automate and collect information on spin qubits, including sources of quantum noise and the quality of quantum dots. This will enable Intel to speed feedback into the silicon spin qubit fabrication line, and accelerate quantum computing research and development.

Thomas Watson, a quantum engineer in the Quantum Hardware, Components Research Group at Intel, will share cryoprober results in his presentation on High Volume Manufacturing of Silicon Spin Qubits during the Quantum Computing Industry Session. High volume manufacturing in the semiconductor industry has enabled the integration of billions of transistors on a single chip and could be used to address the significant engineering challenges for the scale up of quantum computers. Using Intel’s 300mm infrastructure to fabricate highly coherent (T2CPMG ~ 3ms) silicon spin qubits — similar in size to transistors — enables integration with advanced CMOS technologies. In addition, the new 300mm cryoprober measurement infrastructure provides much faster and statistically relevant feedback to the fab to accelerate device improvements.

Intel and Research Collaborators Papers at APS March Meeting 2021

Quantum Software and Compilers II - Compute Frameworks and Program Representations

    · Fast Simulation of Quantum Algorithms Using Circuit Optimization

Quantum Computing Algorithms IV

    · Graph Optimization Perspective for Low-Depth Trotter-Suzuki Decomposition

    · Quantum Algorithms for Astrochemistry and Atmospheric Science: Calculating Vibrational Spectra

Semiconductor Qubits I

    · All Optical 300mm Process Line for Spin Qubit Devices

    · Toward Scalable Spin Qubits: Si/Sige Quantum Dot Devices Built on a 300mm Process Line

Semiconductor Qubits II

    · Systematic Charge Noise Characterization of Intel Quantum Dot Devices

Designing High Fidelity Gates for Spin Qubits

    · Device and Materials Considerations for Scaling of Spin Qubit Devices

Noisy Intermediate Scale Quantum Computers III

    · Variational Preparation of Finite-Temperature States on a Quantum Computer (Part 1: Theory)

    · Variational Preparation of Finite-Temperature States on a Quantum Computer (Part 2: Experiment)