Intel® Server System R1208WT2GSR
Essentials
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Product Collection
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Code Name
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Launch Date
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Q1'16
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Marketing Status
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Discontinued
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Expected Discontinuance
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Q3'20
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EOL Announce
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Friday, July 19, 2019
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Last Order
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Sunday, July 5, 2020
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Last Receipt Attributes
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Monday, October 5, 2020
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Limited 3-year Warranty
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Yes
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Extended Warranty Available for Purchase (Select Countries)
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Yes
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Additional Extended Warranty Details
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Chassis Form Factor
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1U, Spread Core Rack
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Chassis Dimensions
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16.93" x 27.95" x 1.72"
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Board Form Factor
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Custom 16.7" x 17"
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Rack Rails Included
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No
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Compatible Product Series
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Intel® Xeon® Processor E5-2600 v4 Family
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Socket
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Socket R3
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TDP
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145 W
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Heat Sink
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2
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Heat Sink Included
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Yes
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System Board
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Board Chipset
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Target Market
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Cloud/Datacenter
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Rack-Friendly Board
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Yes
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Power Supply
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750 W
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Power Supply Type
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AC
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# of Power Supply Included
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1
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Redundant Fans
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Yes
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Redundant Power Supported
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Supported, requires additional power supply
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Backplanes
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Included
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Included Items
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(1) Intel® Server Board S2600WT2R w/ Dual 1GbE; (1) standard control panel board (FXXFPANEL); (1) front I/O panel assembly (front 1xVGA and 2x USB); (8) 2.5 inch hot-swap drive carriers (FXX25HSCAR); (1) 12Gb SAS backplane (F1U8X25S3HSBP); (1) 730mm SAS/SATA Multiport data cable with straight SFF8643 to right angle SFF8643 connectors (AXXCBL1UHRHD); (1) 800mm SAS/SATA Multiport data cable with straight SFF8643 to right angle SFF8643 connectors (AXXCBL1UHRHD); (2) processor heatsink (FXXCA84X106HS); (2) risers with 1x16 PCIe* 3.0 FHHL slot on each (F1UL16RISER); (1) 750W AC power supply (FXX750PCRPS); (1) Air duct; (6) Dual rotor system fans (FR1UFAN10PW)
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Supplemental Information
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Description
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Integrated 1U system featuring an Intel® Server Board S2600WT2R supporting eight 2.5 inch hot-swap drives, dual 1-GbE LAN, 24 DIMMs, one 750W redundant-capable power supply, enterprise class I/O, with built in discrete management network interface.
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Memory & Storage
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Memory Types
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DDR4-1600/1866/2133/2400
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# of Memory Slots
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24
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Max Memory Size (dependent on memory type)
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1.5 TB
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# of Front Drives Supported
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8
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Front Drive Form Factor
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Hot-swap 2.5"
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Rear Drive Form Factor
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N/A
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GPU Specifications
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Integrated Graphics ‡
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Yes
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Expansion Options
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PCIe x16 Gen 3
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2
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I/O Specifications
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# of USB Ports
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8
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Total # of SATA Ports
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10
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RAID Configuration
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SW RAID 0, 1, 10, optional 5
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# of Serial Ports
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2
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Integrated LAN
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2x 1GbE
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# of LAN Ports
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2
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Optical Drive Support
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Yes
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Integrated SAS Ports
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0
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Embedded USB (eUSB) Solid State Drive Option
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Yes
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Integrated InfiniBand*
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No
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Package Specifications
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Max CPU Configuration
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2
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Advanced Technologies
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Intel® Remote Management Module Support
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Yes
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Integrated BMC with IPMI
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IPMI 2.0 with OEM extensions
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Intel® Node Manager
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Yes
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Intel® On-Demand Redundant Power
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Yes
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Intel® Advanced Management Technology
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Yes
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Intel® Server Customization Technology
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Yes
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Intel® Build Assurance Technology
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Yes
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Intel® Efficient Power Technology
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Yes
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Intel® Quiet Thermal Technology
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Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
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Yes
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Intel® Matrix Storage Technology
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No
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Intel® Rapid Storage Technology
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No
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Intel® Rapid Storage Technology enterprise
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Yes
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Intel® Quiet System Technology
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Yes
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Intel® Fast Memory Access
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Yes
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Intel® Flex Memory Access
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Yes
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Intel® I/O Acceleration Technology
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Yes
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TPM Version
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1.2/2.0
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.