Intel® Server System M50FCP1UR204
Essentials
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Product Collection
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Code Name
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Launch Date
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Q1'23
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Marketing Status
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Discontinued
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Expected Discontinuance
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2023
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EOL Announce
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Friday, May 5, 2023
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Last Order
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Friday, June 30, 2023
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Limited 3-year Warranty
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Yes
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Extended Warranty Available for Purchase (Select Countries)
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Yes
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Additional Extended Warranty Details
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Chassis Form Factor
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1U Rack
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Chassis Dimensions
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767 x 438 x 43 mm
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Board Form Factor
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18.79” x 16.84”
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Rack Rails Included
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No
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Compatible Product Series
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4th Gen Intel® Xeon® Scalable Processors, 5th Gen Intel® Xeon® Scalable Processors
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Socket
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Socket-E LGA4677
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TDP
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350 W
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Heat Sink Included
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Yes
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System Board
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Board Chipset
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Target Market
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Mainstream
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Rack-Friendly Board
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Yes
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Power Supply
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1600 W
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Power Supply Type
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AC
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# of Power Supply Included
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0
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Redundant Fans
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Yes
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Redundant Power Supported
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Yes
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Backplanes
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Included
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Included Items
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(1) – 1U 2.5" chassis – iPN M36832-xxx
(1) – Server board – iPC M50FCP2SBSTD (1) 4 x 2.5" combo HSBP – iPC CYPHSBP1204 (4) Drive mounting rails – iPN K53035-xxx (4) 2.5" SSD blank – iPN K71491- xxx (1) Riser #1 Bracket (1) 1-Slot x16 LP PCIe riser card (Riser Slot #1) – iPC FCP1URISER1 (1) – Riser #2 Bracket - iPN K72604-001 (1) – Front panel (left) with two USB ports – iPN K48177- xxx (1) – Front Panel (left) USB cable– iPN K67061- xxx (1) – Front panel (right) with control panel – iPN K48178- xxx (1) – Front panel (right) cable pin – iPN K67060- xxx (8) – Dual-rotor system fans – iPC CYPFAN1UKIT (16) – DIMM slot blanks – iPN M45676- xxx (2) – EVAC CPU heat sinks – iPN FCP1UHSEVAC (2) – E1A (XCC) processor clips – iPN AXXSPRXCCCC (2) - E1B (MCC) processor clips - iPN AXXSPRMCCCC (1) – Air baffle (left) – iPN K72602- xxx (1) – Air baffle (right) – iPN K72603- xxx (1) – Intel® RAID Maintenance Free Backup Unit (RMFBU) bracket NOTE: NO PSU included |
Supplemental Information
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Description
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Integrated 1U system featuring an Intel® Server Board M50FCP2SBSTD,
supporting two 4th Generation Intel® Xeon® Scalable processors, (4) 2.5" SSD with air cooling. NOTE: NO PSU included |
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Memory & Storage
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Memory Types
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• DDR5 (RDIMM)
• 3DS-RDIMM • 9x4 RDIMM • Intel® Optane™ PMem 300 series |
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# of Memory Slots
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32
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Max Memory Size (dependent on memory type)
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12 TB
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# of Front Drives Supported
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4
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Front Drive Form Factor
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Hot-swap 2.5" SSD
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# of Internal Drives Supported
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2
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Internal Drive Form Factor
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M.2 SSD
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Intel® Optane™ Persistent Memory Supported
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Yes
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GPU Specifications
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Integrated Graphics ‡
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Yes
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Expansion Options
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PCI Express Revision
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5.0
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Riser Slot 1: Total # of Lanes
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16
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Riser Slot 2: Total # of Lanes
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24
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Riser Slot 3: Total # of Lanes
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16
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I/O Specifications
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Open Compute Port (OCP) Support
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1 x 3.0
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# of USB Ports
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5
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Total # of SATA Ports
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10
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USB Configuration
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• One USB 3.0 port at back panel
• Two USB 2.0 ports at back panel • One USB 3.0 port front panel • One USB 2.0 port front panel |
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Max # of UPI Links
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3
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RAID Configuration
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0/1/5/10
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# of Serial Ports
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1
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Package Specifications
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Max CPU Configuration
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2
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Advanced Technologies
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Advanced System Management key
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Yes
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Intel® Optane™ Memory Supported ‡
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Yes
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Intel® Remote Management Module Support
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Yes
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Integrated BMC with IPMI
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IPMI 2.0 & Redfish
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Intel® Node Manager
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Yes
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Intel® Advanced Management Technology
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Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
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Yes
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TPM Version
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2.0
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Security & Reliability
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Intel® Total Memory Encryption
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Yes
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Intel® Trusted Execution Technology ‡
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Yes
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.