Product Collection
Intel® 500 Series Mobile Chipsets
Vertical Segment
Embedded
Marketing Status
Launched
Launch Date
Q3'21
TDP
3.4 W
Recommended Customer Price
$59.00
Use Conditions
Embedded Broad Market Extended Temp, Industrial Extended Temp

Supplemental Information

Embedded Options Available
Yes

Memory Specifications

# of DIMMs per channel
2
ECC Memory Supported
Yes
Supports Memory Overclocking
No

GPU Specifications

# of Displays Supported
4

Expansion Options

Direct Media Interface (DMI) Revision
3.0
Max # of DMI Lanes
8
PCI Express Revision
3.0
PCI Express Configurations
x1, x2, x4
Max # of PCI Express Lanes
24

I/O Specifications

Time Sensitive Networking (TSN)
Yes
# of USB Ports
14
USB Configuration
10 USB 3.2 Ports
- Up to 10 USB 3.2 Gen 2x1 (10Gb/s) Ports
- Up to 10 USB 3.2 Gen 1x1 (5Gb/s) Ports
14 USB 2.0 Ports
USB Revision
3.2, 2.0
Max # of SATA 6.0 Gb/s Ports
8
RAID Configuration
PCIe 0,1,5 / SATA 0,1,5,10
Integrated LAN
Integrated MAC
Integrated Wireless
Intel® Wi-Fi 6 AX201
Supported Processor PCI Express Port Configurations
1x16+1x4 or 2x8+1x4 or 1x8+3x4

Package Specifications

Package Size
25mm x 24mm

Advanced Technologies

Intel® Optane™ Memory Supported
No
Intel® Virtualization Technology for Directed I/O (VT-d)
Yes
Intel® ME Firmware Version
15
Intel® HD Audio Technology
Yes
Intel® Rapid Storage Technology
Yes
Intel® Standard Manageability
Yes
Intel® Stable IT Platform Program (SIPP)
Yes
Intel® Smart Sound Technology
Yes
Intel® Platform Trust Technology (Intel® PTT)
Yes

Security & Reliability

Intel vPro® Eligibility
Intel vPro® Platform
Intel® Trusted Execution Technology
Yes
Intel® Boot Guard
Yes